The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Feb. 09, 2015
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Assignee:
ams AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 23/31 (2013.01); H01L 23/3157 (2013.01); H01L 23/481 (2013.01); H01L 23/485 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 23/562 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/03001 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05563 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05576 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13027 (2013.01);
Abstract
The semiconductor device comprises a semiconductor substrate () with a main surface () and a further main surface () opposite the main surface, a TSV () penetrating the substrate from the main surface to the further main surface, a metallization () of the TSV, an under-bump metallization () and a bump contact () at least partially covering the TSV at the further main surface. The TSV () comprises a cavity (), which may be filled with a gas or liquid. An opening (') of the cavity is provided to expose the cavity to the environment.
Quick Actions:
Schrems, Martin. (2019). Semiconductor device with a bump contact on a tsv comprising a cavity and method of producing such a semiconductor device (U.S. Patent No. 10217715). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10217715
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile