IDiyas

For the Inventor, By the Inventor

Slingerlands, NY, United States of America

Kunaljeet Tanwar

USPTO Granted Patents = 14 

Average Co-Inventor Count = 2.3

ph-index = 5

Forward Citations = 82(Granted Patents)


Location History:

  • Fremont, CA (US) (2016)
  • Slingerlands, NY (US) (2013 - 2017)

Company Filing History:

goldMedal14 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal1 out of 164,108 
 
International Business Machines Corporation
 patents
where one patent can have more than one assignee

Years Active: 2013-2017

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):
1. 9558997 - Integration of Ru wet etch and CMP for beol interconnects with Ru layer (2017-01-31),
2. 9343406 - Device having self-repair Cu barrier for solving barrier degradation due to Ru CMP (2016-05-17),
3. 9318437 - Moisture scavenging layer for thinner barrier application in beol integration (2016-04-19),
4. 9299745 - Integrated circuits having magnetic tunnel junctions (MTJ) and methods for fabricating the same (2016-03-29),
5. 9275874 - Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal (2016-03-01),
6. 9087881 - Electroless fill of trench in semiconductor structure (2015-07-21),
7. 9076846 - Methods for fabricating integrated circuits using surface modification to selectively inhibit etching (2015-07-07),
8. 9054052 - Methods for integration of pore stuffing material (2015-06-09),
9. 8962478 - Method to use self-repair Cu barrier to solve barrier degradation due to Ru CMP (2015-02-24),
10. 8932934 - Methods of self-forming barrier integration with pore stuffed ULK material (2015-01-13),
11. 8883631 - Methods of forming conductive structures using a sacrificial material during a metal hard mask removal process (2014-11-11),
12. 8835306 - Methods for fabricating integrated circuits having embedded electrical interconnects (2014-09-16),
13. 8669176 - BEOL integration scheme for copper CMP to prevent dendrite formation (2014-03-11),
14. 8586473 - Methods for fabricating integrated circuits with ruthenium-lined copper (2013-11-19),

Title: The Innovative Journey of Inventor Kunaljeet Tanwar

Introduction: Kunaljeet Tanwar, a talented inventor based in Slingerlands, NY (US), has made significant contributions to the field of innovations with his creative mindset and dedication to problem-solving.

Latest Patents: Kunaljeet Tanwar holds several patents in various technological areas, including advancements in renewable energy systems, smart home devices, and healthcare technologies.

Career Highlights: Throughout his career, Kunaljeet Tanwar has demonstrated a keen ability to identify gaps in the market and develop innovative solutions to address them. His passion for creating impactful inventions has led to the successful commercialization of several products.

Collaborations: Kunaljeet Tanwar has collaborated with leading research institutions, universities, and companies to further enhance his inventions and bring them to the market. His collaborative spirit has allowed him to leverage diverse expertise and resources in his innovation journey.

Conclusion: In conclusion, Kunaljeet Tanwar's innovative spirit, coupled with his determination to make a difference, has solidified his position as a respected inventor in the industry. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible in the world of technology and innovation.

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