The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Nov. 04, 2013
Globalfoundries, Inc., Grand Cayman, KY (US);
Errol Todd Ryan, Clifton Park, NY (US);
Kunaljeet Tanwar, Slingerlands, NY (US);
Xunyuan Zhang, Albany, NY (US);
GLOBALFOUNDRIES, INC., Grand Cayman, KY;
Abstract
Methods for fabricating integrated circuits are provided in various exemplary embodiments. In one embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate having a first exposed surface including an elemental metal material and a second exposed surface including a barrier material. The elemental metal material has a first etch rate when exposed to a wet etchant and the barrier material has a second etch rate when exposed to the wet etchant. Further, the method includes modifying the first exposed surface to form a modified first exposed surface so as to reduce the first etch rate when exposed to the wet etchant and applying the wet etchant simultaneously to the modified first exposed surface and to the second exposed surface.