The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Jun. 26, 2012
Applicants:

Kunaljeet Tanwar, Slingerlands, NY (US);

Xunyuan Zhang, Albany, NY (US);

Ming He, Slingerlands, NY (US);

Inventors:

Kunaljeet Tanwar, Slingerlands, NY (US);

Xunyuan Zhang, Albany, NY (US);

Ming He, Slingerlands, NY (US);

Assignee:

GLOBALFOUNDRIES, Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes depositing a dielectric layer defining a plane. In the method, the dielectric layer is etched to form trenches. Then, a ruthenium-containing liner layer is deposited overlying the dielectric layer. The trenches are filled with copper-containing metal. The method includes recessing the copper-containing metal in each trench to form a space between the copper-containing metal and the plane. The space is filled with a capping layer. The layers are then planarized to at least the plane.


Find Patent Forward Citations

Loading…