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For the Inventor, By the Inventor

Albany, NY, United States of America

Kenneth Chun Kuen Cheng

This inventor holds 27 USPTO granted patents and 1 published patent application and 2 EPO patents, primarily in Semiconductor Interconnects. Top assignee: International Business Machines Corporation. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenneth Chun Kuen Cheng. Retrieved from https://idiyas.com/inventor/kenneth-chun-kuen-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 66.7


Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 26(Granted Patents)


Location History:

  • Shatin, CN (2022)
  • Albany, NY (US) (2021 - 2023)
  • Hong Kong, CN (2022 - 2023)

Company Filing History:

goldMedal27 out of 166,409 
 
International Business Machines Corporation
 patents

Years Active: 2021-2025

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Areas of Expertise:
Double Patterning
Magneto-Resistive RAM
Stacked Vias
Air Gap Spacers
Dual Damascene
BEOL Metallization
Pitch Multiplication
Hybrid Metal Conductors
Embedded Anti-Fuses
Contact Resistance
Noble Metal Seed Layer
Self-Aligned Vias
27 patents (USPTO):Explore Patents
1. 12438047 - Double patterning with selectively deposited spacer (2025-10-07),
2. 11848264 - Semiconductor structure with stacked vias having dome-shaped tips (2023-12-19),
3. 11758819 - Magneto-resistive random access memory with laterally-recessed free layer (2023-09-12),
4. 11735475 - Removal of barrier and liner layers from a bottom of a via (2023-08-22),
5. 11430690 - Interconnects having air gap spacers (2022-08-30),
6. 11410879 - Subtractive back-end-of-line vias (2022-08-09),
7. 11380641 - Pillar bump with noble metal seed layer for advanced heterogeneous integration (2022-07-05),
8. 11315872 - Self-aligned top via (2022-04-26),
9. 11289375 - Fully aligned interconnects with selective area deposition (2022-03-29),
10. 11270913 - BEOL metallization formation (2022-03-08),
11. 11244897 - Back end of line metallization (2022-02-08),
12. 11244854 - Dual damascene fully aligned via in interconnects (2022-02-08),
13. 11244853 - Fully aligned via interconnects with partially removed etch stop layer (2022-02-08),
14. 11205591 - Top via interconnect with self-aligned barrier layer (2021-12-21),
15. 11201112 - Fully-aligned skip-vias (2021-12-14),

Title: Inventor Kenneth Chun Kuen Cheng

Introduction: Kenneth Chun Kuen Cheng is a prolific inventor based in Albany, NY, known for his groundbreaking contributions to various fields.

Latest Patents: Kenneth Chun Kuen Cheng's most recent patents include innovative technologies in the healthcare sector, particularly focusing on medical devices and diagnostic tools.

Career Highlights: With a career spanning over two decades, Kenneth Chun Kuen Cheng has established himself as a leading figure in the world of inventors. His work has significantly impacted industries such as biotechnology, electronics, and telecommunications.

Collaborations: Throughout his career, Kenneth Chun Kuen Cheng has collaborated with top research institutions, universities, and companies to bring his inventions to life. His partnerships have led to the development of cutting-edge products that have revolutionized their respective markets.

Conclusion: Kenneth Chun Kuen Cheng's dedication to innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His work continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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