The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Dec. 24, 2020
International Business Machines Corporation, Armonk, NY (US);
Kenneth Chun Kuen Cheng, Shatin, HK;
Koichi Motoyama, Clifton Park, NY (US);
Oscar van der Straten, Guilderland Center, NY (US);
Joseph F. Maniscalco, Lake Katrine, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure includes a substrate. A first metallization layer is disposed on the substrate. A second metallization layer is disposed on the first metallization layer and having one or more openings, wherein at least one of the one or more openings is configured to expose a top surface of the first metallization layer. A polymer-adhering liner layer is disposed on sidewalls of the at least one of the one more openings in the second metallization layer. A dielectric polymer is disposed in the at least one of the one or more openings in the second metallization layer and on the polymer-adhering liner layer. The dielectric polymer is configured to seal an air gap in the dielectric polymer.