The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Dec. 10, 2020
International Business Machines Corporation, Armonk, NY (US);
Chanro Park, Clifton Park, NY (US);
Koichi Motoyama, Clifton Park, NY (US);
Kenneth Chun Kuen Cheng, Shatin, CN;
Kisik Choi, Watervliet, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Embodiments of the invention include a method for fabricating a semiconductor device and the resulting structure. Mandrels are patterned on a liner, where the liner is located on a semiconductor substrate. Spacers are formed on sidewalls of the mandrels. Dielectric material lines are formed on exposed surfaces of the liner and within a plurality of gaps between the spacers. The mandrels are removed. The at least one of the dielectric material lines are removed from within at least one of the plurality of gaps between the spacers. Conductive metal is formed within each gap. The conductive metal is patterned to form metal interconnect lines and vias. The plurality of spacers and the remaining dielectric material lines are removed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile