The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Dec. 18, 2021
International Business Machines Corporation, Armonk, NY (US);
Chanro Park, Clifton Park, NY (US);
Hseuh-Chung Chen, Cohoes, NY (US);
Koichi Motoyama, Shatin, HK;
Kenneth Chun Kuen Cheng, Boxborough, MA (US);
Chih-Chao Yang, Glenmont, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A first metal interconnection pattern is formed over a substrate. A spacer layer is selectively deposited on the exposed surfaces of the first metal interconnection pattern. Subsequently, a metal overburden layer is deposited on the spacer layer. The excess portion of the metal overburden layer is removed, i.e., that portion deposited over a top surface of the metal interconnection pattern and the spacer layer. This forms a second metal interconnection pattern. The elements of the second metal interconnection pattern are located between respective elements of the first metal interconnection pattern.