Koichi Motoyama

Title: Koichi Motoyama: Innovator in Metal Interconnection Patterns

Introduction

Koichi Motoyama is a notable inventor based in Hong Kong, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of metal interconnection patterns. His innovative work has led to the development of a unique patent that enhances the efficiency of electronic devices.

Latest Patents

Motoyama holds a patent for a method titled "Double patterning with selectively deposited spacer." This invention involves forming a first metal interconnection pattern over a substrate. A spacer layer is selectively deposited on the exposed surfaces of the first metal interconnection pattern. Subsequently, a metal overburden layer is deposited on the spacer layer. The excess portion of the metal overburden layer is then removed, specifically that portion deposited over the top surface of the metal interconnection pattern and the spacer layer. This process results in the formation of a second metal interconnection pattern, with the elements of the second pattern located between the respective elements of the first pattern.

Career Highlights

Koichi Motoyama is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with leading experts in the field, further advancing his research and innovations.

Collaborations

Some of his notable coworkers include Chanro Park and Hseuh-Chung Chen. Their collaborative efforts contribute to the ongoing advancements in semiconductor technology and innovation.

Conclusion

Koichi Motoyama's contributions to the field of semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing electronic device efficiency. His work continues to influence the industry and inspire future innovations.