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For the Inventor, By the Inventor

Toyama, Japan

Kenji Kameda

This inventor holds 33 USPTO granted patents and 1 published patent application and 2 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Kokusai Electric Corporation, Hitachi-Kokusai Electric Inc., Sony Corporation. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Kameda. Retrieved from https://idiyas.com/inventor/kenji-kameda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 

% Patents Active = 90.9

 

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 77(Granted Patents)


Location History:

  • Shibuya-ku, JP (2022)
  • Tokyo, JP (2006 - 2023)
  • Toyama, JP (2014 - 2024)

Company Filing History:

goldMedal13 out of 697 
 
Kokusai Electric Corporation
 patents
silverMedal12 out of 1,258 
 
Hitachi-Kokusai Electric Inc.
 patents
bronzeMedal6 out of 58,145 
 
Sony Corporation
 patents
4. 3 out of 2,260 
 
Japan Aviation Electronics Industry, Limited
 patents
5. 2 out of 363 
 
Canon Anelva Corporation
 patents
6. 2 out of 1,010 
 
Central Glass Company, Limited
 patents
7. 2 out of 1,765 
 
National Institute of Advanced Industrial Science and Technology
 patents
8. 2 out of 7,654 
 
Renesas Electronics Corporation
 patents
9. 2 out of 8,782 
 
Sanyo Electric Co., Ltd.
 patents
10. 2 out of 10,904 
 
Tokyo Electron Limited
 patents
11. 2 out of 447 
 
Ulvac, Inc.
 patents
12. 1 out of 1,674 
 
Fujitsu Semiconductor Limited
 patents
13. 1 out of 77 
 
Kanto Denka Kogyo Co., Ltd.
 patents
14. 1 out of 1,527 
 
L'air Liquide,societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude
 patents
15. 1 out of 21,351 
 
Mitsubishi Denki Kabushiki Kaisha
 patents
16. 1 out of 16,454 
 
Panasonic Corporation
 patents
17. 1 out of 1,961 
 
Showa Denko K.k.
 patents
where one patent can have more than one assignee

Years Active: 2006-2026

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Areas of Expertise:
Substrate Processing
Semiconductor Device
Cleaning Method
CVD Apparatus
Manufacturing Method
Wire Harness
Animation Generation
Map Display System
Boundary Line Detection
Recording Medium
Process Container
Adhering Matter Removal
33 patents (USPTO):Explore Patents
1. 12677612 - Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2026-07-07),
2. 12540388 - Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2026-02-03),
3. 12053805 - Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2024-08-06),
4. 11735412 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2023-08-22),
5. 11705326 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2023-07-18),
6. 11616334 - Method of manufacturing cable assembly, horn chip used in the method and cable assembly manufactured by the method (2023-03-28),
7. 11515152 - Method of manufacturing semiconductor device, substrate processing apparatus, and method of processing substrate (2022-11-29),
8. 11398686 - Wire, wire with terminal, harness, manufacturing method for wire, and manufacturing method for wire with terminal (2022-07-26),
9. 11094532 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2021-08-17),
10. 11001923 - Method of manufacturing semiconductor device and recording medium (2021-05-11),
11. 10998647 - Harness with a wire terminal (2021-05-04),
12. 10968517 - Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2021-04-06),
13. 10804100 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2020-10-13),
14. 10724137 - Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining method (2020-07-28),
15. 10176988 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2019-01-08),

Title: Kenji Kameda: Pioneering Inventor from Toyama

Introduction: Kenji Kameda is a renowned inventor hailing from Toyama, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kenji Kameda holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kenji Kameda has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs. His innovative solutions have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Kenji Kameda has collaborated with top researchers, engineers, and scientists both locally and internationally. His collaborative efforts have resulted in the development of cutting-edge technologies that have had a lasting impact on various sectors.

Conclusion: Kenji Kameda's passion for innovation and his relentless pursuit of technological excellence have solidified his reputation as a visionary inventor. His contributions continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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