The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Sep. 18, 2018
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Kimihiko Nakatani, Toyama, JP;

Kenji Kameda, Toyama, JP;

Atsushi Sano, Toyama, JP;

Tatsuru Matsuoka, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/30 (2006.01); C23C 16/36 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); C23C 16/308 (2013.01); C23C 16/36 (2013.01); C23C 16/401 (2013.01); C23C 16/45525 (2013.01); C23C 16/45531 (2013.01); C23C 16/45578 (2013.01); C23C 16/52 (2013.01); H01L 21/02126 (2013.01); H01L 21/02167 (2013.01); H01L 21/02216 (2013.01); H01L 21/02219 (2013.01); H01L 21/02222 (2013.01);
Abstract

There is provided a method of forming a film with improved step coverage on a substrate by performing, a predetermined number of times, forming a first layer by supplying a halogen-free precursor having a first chemical bond cut by thermal energy at a first temperature and a second chemical bond cut by thermal energy at a second temperature lower than the first temperature and having a ratio of the number of first chemical bonds to the number of second chemical bonds in one molecule thereof, the ratio being equal to or more than 3, to the substrate at a temperature equal to or higher than the second temperature and lower than the first temperature.


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