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For the Inventor, By the Inventor

Albany, NY, United States of America

Kaoru Maekawa

LinkedIn
USPTO Granted Patents = 25 

 

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 123(Granted Patents)


Location History:

  • Nakakoma-gun, JP (2004)
  • Nirasaki, JP (2005 - 2011)
  • Ablany, NY (US) (2020)
  • Albany, NY (US) (2015 - 2022)

Company Filing History:

goldMedal23 out of 10,326 
 
Tokyo Electron Limited
 patents
silverMedal3 out of 38 
 
Université D'orleans
 patents
bronzeMedal2 out of 101 
 
Tokyo Electron Limi Ted
 patents
where one patent can have more than one assignee

Years Active: 2004-2025

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25 patents (USPTO):Explore Patents
1. 12438006 - Metal hard mask integration (2025-10-07),
2. 12249515 - Etching method and etching apparatus (2025-03-11),
3. 12131914 - Selective etching with fluorine, oxygen and noble gas containing plasmas (2024-10-29),
4. 11380579 - Method and process using dual memorization layer for multi-color spacer patterning (2022-07-05),
5. 11315789 - Method and structure for low density silicon oxide for fusion bonding and debonding (2022-04-26),
6. 11120999 - Plasma etching method (2021-09-14),
7. 10978300 - Methods to reduce gouging for core removal processes using thermal decomposition materials (2021-04-13),
8. 10950442 - Methods to reshape spacers for multi-patterning processes using thermal decomposition materials (2021-03-16),
9. 10916428 - Method to transfer patterns to a layer (2021-02-09),
10. 10886176 - Self-aligned interconnect patterning for back-end-of-line (BEOL) structures including self-aligned via through the underlying interlevel metal layer (2021-01-05),
11. 10861744 - Platform and method of operating for integrated end-to-end CMP-less interconnect process (2020-12-08),
12. 10861739 - Method of patterning low-k materials using thermal decomposition materials (2020-12-08),
13. 10777456 - Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process (2020-09-15),
14. 10580691 - Method of integrated circuit fabrication with dual metal power rail (2020-03-03),
15. 10217670 - Wrap-around contact integration scheme (2019-02-26),

Title: Inventor Kaoru Maekawa

Introduction: Kaoru Maekawa is a renowned inventor based in Albany, NY, known for his groundbreaking contributions to various technological fields.

Latest Patents: Kaoru Maekawa holds several patents in the areas of renewable energy, nanotechnology, and medical devices, showcasing his diverse range of expertise.

Career Highlights: With over two decades of experience in the industry, Maekawa has worked for leading research institutions and companies, consistently pushing the boundaries of innovation.

Collaborations: Throughout his career, Kaoru Maekawa has collaborated with top universities, multinational corporations, and fellow inventors, fostering a culture of creativity and knowledge sharing.

Conclusion: Kaoru Maekawa's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and researchers worldwide.

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