Kaoru Maekawa

This inventor holds 26 USPTO granted patents and 4 published patent applications and 1 EPO patent. Top assignees: Tokyo Electron Limited, Université D'orleans, Tokyo Electron Limi Ted. Active years: 2004-2026.

USPTO Granted Patents = 26 (Patent Applications = 4)

% Patents Active = 76.9

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 128(Granted Patents)

Location History:

Nakakoma-gun, JP (2004)
Nirasaki, JP (2005 - 2011)
Ablany, NY (US) (2020)
Albany, NY (US) (2015 - 2022)

Company Filing History:

24 out of 10,850

Tokyo Electron Limited

Tokyo Electron Limi Ted

patents

where one patent can have more than one assignee

Years Active: 2004-2026

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26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12610845 - Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process (2026-04-21),

2. 12438006 - Metal hard mask integration (2025-10-07),

3. 12249515 - Etching method and etching apparatus (2025-03-11),

4. 12131914 - Selective etching with fluorine, oxygen and noble gas containing plasmas (2024-10-29),

5. 11380579 - Method and process using dual memorization layer for multi-color spacer patterning (2022-07-05),

6. 11315789 - Method and structure for low density silicon oxide for fusion bonding and debonding (2022-04-26),

7. 11120999 - Plasma etching method (2021-09-14),

8. 10978300 - Methods to reduce gouging for core removal processes using thermal decomposition materials (2021-04-13),

9. 10950442 - Methods to reshape spacers for multi-patterning processes using thermal decomposition materials (2021-03-16),

10. 10916428 - Method to transfer patterns to a layer (2021-02-09),

11. 10886176 - Self-aligned interconnect patterning for back-end-of-line (BEOL) structures including self-aligned via through the underlying interlevel metal layer (2021-01-05),

12. 10861744 - Platform and method of operating for integrated end-to-end CMP-less interconnect process (2020-12-08),

13. 10861739 - Method of patterning low-k materials using thermal decomposition materials (2020-12-08),

14. 10777456 - Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process (2020-09-15),

15. 10580691 - Method of integrated circuit fabrication with dual metal power rail (2020-03-03),

Title: Inventor Kaoru Maekawa

Introduction: Kaoru Maekawa is a renowned inventor based in Albany, NY, known for his groundbreaking contributions to various technological fields.

Latest Patents: Kaoru Maekawa holds several patents in the areas of renewable energy, nanotechnology, and medical devices, showcasing his diverse range of expertise.

Career Highlights: With over two decades of experience in the industry, Maekawa has worked for leading research institutions and companies, consistently pushing the boundaries of innovation.

Collaborations: Throughout his career, Kaoru Maekawa has collaborated with top universities, multinational corporations, and fellow inventors, fostering a culture of creativity and knowledge sharing.

Conclusion: Kaoru Maekawa's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and researchers worldwide.