The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Apr. 22, 2022
Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process
Tokyo Electron Limited, Tokyo, JP;
Kevin Ryan, Albany, NY (US);
Hirokazu Aizawa, Albany, NY (US);
Kaoru Maekawa, Albany, NY (US);
Satohiko Hoshino, Albany, NY (US);
Yoshihiro Tsutsumi, Albany, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method for making forming a semiconductor package comprises forming a plurality of alignment marks in or on a carrier substrate; positioning and bonding a plurality of semiconductor dies to the carrier substrate based on the plurality of alignment marks; further processing the plurality of semiconductor dies into a reconstituted wafer; and decoupling the reconstituted wafer from the carrier substrate at an interface using a laser source. The alignment marks are interposed between the interface and the laser source.