The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jul. 02, 2019
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Yuki Kikuchi, Albany, NY (US);
Toshiharu Wada, Albany, NY (US);
Kaoru Maekawa, Albany, NY (US);
Akiteru Ko, Albany, NY (US);
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/0206 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01);
Abstract
Embodiments are disclosed that improve etch uniformity during multi-patterning processes for the manufacture of microelectronic workpieces by reshaping spacers using thermal decomposition materials as a protective layer. Because the thermal decomposition material can be removed through thermal treatment processes without requiring etch processes, spacers can be reshaped with no spacer profile change or damage while suppressing undesired gouging differences in underlying layers and related degradation in etch uniformity.