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For the Inventor, By the Inventor

Albany, NY, United States of America

Toshiharu Wada

USPTO Granted Patents = 11 

Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Albany, NY (US) (2020 - 2022)
  • Miyagi, JP (2017 - 2023)

Company Filing History:

goldMedal10 out of 10,326 
 
Tokyo Electron Limited
 patents
silverMedal1 out of 101 
 
Tokyo Electron Limi Ted
 patents

Years Active: 2017-2023

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11 patents (USPTO):Explore Patents
1. 11557479 - Methods for EUV inverse patterning in processing of microelectronic workpieces (2023-01-17),
2. 11537049 - Method of line roughness improvement by plasma selective deposition (2022-12-27),
3. 11276572 - Technique for multi-patterning substrates (2022-03-15),
4. 11049721 - Method and process for forming memory hole patterns (2021-06-29),
5. 10978300 - Methods to reduce gouging for core removal processes using thermal decomposition materials (2021-04-13),
6. 10950442 - Methods to reshape spacers for multi-patterning processes using thermal decomposition materials (2021-03-16),
7. 10916428 - Method to transfer patterns to a layer (2021-02-09),
8. 10861739 - Method of patterning low-k materials using thermal decomposition materials (2020-12-08),
9. 10128085 - Method of plasma etching (2018-11-13),
10. 9847231 - Method of etching (2017-12-19),
11. 9583317 - Plasma processing method and plasma processing apparatus (2017-02-28),

Title: The Innovative Contributions of Toshiharu Wada

Introduction

Toshiharu Wada is a prominent inventor based in Albany, NY, known for his significant contributions to the field of microelectronics. With a total of 11 patents to his name, Wada has made remarkable advancements in processing techniques that enhance the performance and reliability of microelectronic workpieces.

Latest Patents

Wada's latest patents include groundbreaking methods for EUV inverse patterning in the processing of microelectronic workpieces. These methods aim to reduce or eliminate defects commonly experienced with conventional EUV patterning processes. The inverse patterning techniques involve additional process steps, such as an overcoat process, etch back or planarization processes, and a pattern removal process. Furthermore, these techniques can be combined with line smoothing treatments to significantly improve line pattern roughness, thereby enhancing the overall quality of microelectronic devices. Another notable patent focuses on the method of line roughness improvement by plasma selective deposition. This method involves providing a substrate with a patterned layer, such as an EUV photo resist layer, and selectively depositing additional material to improve roughness and lithographic structure height. This innovative approach allows for greater process margin when transferring patterns to underlying layers.

Career Highlights

Throughout his career, Toshiharu Wada has worked with notable companies, including Tokyo Electron Limited. His expertise in microelectronics has positioned him as a key figure in the development of advanced processing techniques that are essential for modern technology.

Collaborations

Wada has collaborated with talented individuals in the field, including Akiteru Ko and Yuki Kikuchi. These collaborations have contributed to the advancement of innovative solutions in microelectronics.

Conclusion

Toshiharu Wada's contributions to the field of microelectronics through his patents and collaborations highlight his role as a leading inventor. His innovative methods continue to shape the future of microelectronic processing, ensuring improved performance and reliability in technology.

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