IDiyas

For the Inventor, By the Inventor

Wuhan, China

Jun Liu

USPTO Granted Patents = 73 

 

Average Co-Inventor Count = 1.5

ph-index = 7

Forward Citations = 148(Granted Patents)


Inventors with similar research interests:


Location History:

  • Hubei, CN (2017 - 2024)
  • Wuhan, CN (2020 - 2024)
  • Dongguan, CN (2024)
  • Guangdong, CN (2024)

Company Filing History:

goldMedal69 out of 1,139 
 
Yangtze Memory Technologies Co., Ltd.
 patents
silverMedal1 out of 26 
 
Wuhan Telecommunication Devices Company
 patents
bronzeMedal1 out of 1 
 
Hubei Boshilong Technology Co., Ltd.
 patent
where one patent can have more than one assignee

Years Active: 2017-2025

Loading Chart...
Loading Chart...
73 patents (USPTO):
1. 12451462 - Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same (2025-10-21),
2. 12431468 - Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same (2025-09-30),
3. 12376278 - Bonded semiconductor devices having processor and static random-access memory and methods for forming the same (2025-07-29),
4. 12148705 - Methods for forming semiconductor devices bonded by interposer structure (2024-11-19),
5. 12078791 - Method for tilting characterization by microscopy (2024-09-03),
6. D1037468 - LED phototherapy device (2024-07-30),
7. D1033661 - Electronic cupping device (2024-07-02),
8. 12002788 - Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same (2024-06-04),
9. 11996389 - Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same (2024-05-28),
10. 11968832 - Multiple-stack three-dimensional memory device and fabrication method thereof (2024-04-23),
11. 11950399 - Bonded semiconductor devices having processor and static random-access memory and methods for forming the same (2024-04-02),
12. 11923339 - Integration of three-dimensional NAND memory devices with multiple functional chips (2024-03-05),
13. 11910602 - Stacked connections in 3D memory and methods of making the same (2024-02-20),
14. 11887954 - Semiconductor devices having adjoined via structures formed by bonding and methods for forming the same (2024-01-30),
15. 11864367 - Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same (2024-01-02),

Certainly! Here is an article about inventor Jun Liu:

Title: Jun Liu: A Pioneering Innovator in Semiconductor Devices

Introduction:

Jun Liu, a distinguished inventor hailing from Wuhan, China, has made significant contributions to the field of semiconductor devices. With an impressive portfolio of 64 patents to his name, Liu's groundbreaking work has revolutionized the landscape of technology.

Latest Patents:

Among his latest patents is the "Multiple-stack three-dimensional memory device and fabrication method thereof," showcasing his expertise in creating innovative three-dimensional memory structures. Additionally, Liu's patent on "Bonded semiconductor devices having processor and static random-access memory" exemplifies his prowess in developing cutting-edge semiconductor devices.

Career Highlights:

Liu has accumulated valuable experience working with prominent companies such as Yangtze Memory Technologies Co., Ltd. and Hubei Boshilong Technology Co., Ltd. His roles in these organizations have allowed him to spearhead projects and drive innovation in the semiconductor industry.

Collaborations:

Throughout his career, Liu has collaborated closely with esteemed colleagues such as Li Hong Xiao and Zongliang Huo. Together, they have worked tirelessly to push the boundaries of technology and bring forth groundbreaking advancements in semiconductor devices.

Conclusion:

In conclusion, Jun Liu stands as a true trailblazer in the realm of semiconductor inventions. His relentless pursuit of innovation and unwavering dedication to excellence continue to inspire future generations of inventors and innovators in the ever-evolving field of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…