Jun Liu

This inventor holds 74 USPTO granted patents and 42 published patent applications and 19 EPO patents, primarily in 3D Memory Devices (CPC class H01L). Top assignees: Yangtze Memory Technologies Co., Ltd., Hubei Boshilong Technology Co., Ltd., Wuhan Telecommunication Devices Company. Active years: 2017-2026.

USPTO Granted Patents = 74 (Patent Applications = 42)

% Patents Active = 98.6

EPO Patents = 19 (Patent Applications = 24)

Average Co-Inventor Count = 1.5

ph-index = 7

Forward Citations = 163(Granted Patents)

Forward Citations (Not Self Cited) = 112(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hubei, CN (2017 - 2024)
Wuhan, CN (2020 - 2024)
Dongguan, CN (2024)
Guangdong, CN (2024)

Company Filing History:

69 out of 1,190

Yangtze Memory Technologies Co., Ltd.

patents

1 out of 1

Hubei Boshilong Technology Co., Ltd.

patent

1 out of 26

Wuhan Telecommunication Devices Company

patents

4. 1 out of 286

Yangtze Memory Technologies., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2017-2026

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Areas of Expertise:

Three-Dimensional Memory

Semiconductor Integration

Dynamic Random-Access Memory

Static Random-Access Memory

NAND Flash Memory

Fabrication Methods

Interposer Structure

Heterogeneous Memories

Bonding Methods

Stacked Connections

Processor Integration

Phototherapy Device

74 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12575105 - Multiple-stack three-dimensional memory device and fabrication method thereof (2026-03-10),

2. 12451462 - Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same (2025-10-21),

3. 12431468 - Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same (2025-09-30),

4. 12376278 - Bonded semiconductor devices having processor and static random-access memory and methods for forming the same (2025-07-29),

5. 12148705 - Methods for forming semiconductor devices bonded by interposer structure (2024-11-19),

6. 12078791 - Method for tilting characterization by microscopy (2024-09-03),

7. D1037468 - LED phototherapy device (2024-07-30),

8. D1033661 - Electronic cupping device (2024-07-02),

9. 12002788 - Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same (2024-06-04),

10. 11996389 - Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same (2024-05-28),

11. 11968832 - Multiple-stack three-dimensional memory device and fabrication method thereof (2024-04-23),

12. 11950399 - Bonded semiconductor devices having processor and static random-access memory and methods for forming the same (2024-04-02),

13. 11923339 - Integration of three-dimensional NAND memory devices with multiple functional chips (2024-03-05),

14. 11910602 - Stacked connections in 3D memory and methods of making the same (2024-02-20),

15. 11887954 - Semiconductor devices having adjoined via structures formed by bonding and methods for forming the same (2024-01-30),

Certainly! Here is an article about inventor Jun Liu:

Title: Jun Liu: A Pioneering Innovator in Semiconductor Devices

Introduction:

Jun Liu, a distinguished inventor hailing from Wuhan, China, has made significant contributions to the field of semiconductor devices. With an impressive portfolio of 64 patents to his name, Liu's groundbreaking work has revolutionized the landscape of technology.

Latest Patents:

Among his latest patents is the "Multiple-stack three-dimensional memory device and fabrication method thereof," showcasing his expertise in creating innovative three-dimensional memory structures. Additionally, Liu's patent on "Bonded semiconductor devices having processor and static random-access memory" exemplifies his prowess in developing cutting-edge semiconductor devices.

Career Highlights:

Liu has accumulated valuable experience working with prominent companies such as Yangtze Memory Technologies Co., Ltd. and Hubei Boshilong Technology Co., Ltd. His roles in these organizations have allowed him to spearhead projects and drive innovation in the semiconductor industry.

Collaborations:

Throughout his career, Liu has collaborated closely with esteemed colleagues such as Li Hong Xiao and Zongliang Huo. Together, they have worked tirelessly to push the boundaries of technology and bring forth groundbreaking advancements in semiconductor devices.

Conclusion:

In conclusion, Jun Liu stands as a true trailblazer in the realm of semiconductor inventions. His relentless pursuit of innovation and unwavering dedication to excellence continue to inspire future generations of inventors and innovators in the ever-evolving field of technology.