The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Apr. 17, 2023
Applicant:
Yangtze Memory Technologies Co., Ltd., Wuhan, CN;
Inventors:
Weihua Cheng, Wuhan, CN;
Jun Liu, Wuhan, CN;
Assignee:
YANGTZE MEMORY TECHNOLOGIES CO., LTD., Wuhan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 10/00 (2023.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/78 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H10B 10/18 (2023.02); H10B 12/50 (2023.02); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06524 (2013.01);
Abstract
A semiconductor device in a multi-chip package (MCP) includes a controller, at least one non-volatile memory die including an array of non-volatile memory cells and connected to the controller through wire bonding, and at least one volatile memory die including an array of volatile memory cells and connected to the controller through wire bonding. The controller is configured to control operations of the at least one non-volatile memory die and the at least one volatile memory die.