Weihua Cheng

This inventor holds 29 USPTO granted patents and 13 published patent applications and 9 EPO patents. Top assignees: Yangtze Memory Technologies Co., Ltd., Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Yangtze Memory Technologies., Ltd.. Active years: 2017-2026.

USPTO Granted Patents = 29 (Patent Applications = 13)

% Patents Active = 96.6

EPO Patents = 9 (Patent Applications = 13)

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 72(Granted Patents)

Location History:

Hubei, CN (2017 - 2023)
Wuhan, CN (2020 - 2024)

Company Filing History:

27 out of 1,190

Yangtze Memory Technologies Co., Ltd.

patents

1 out of 82

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

patents

1 out of 282

Yangtze Memory Technologies., Ltd.

patents

Years Active: 2017-2026

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29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12615760 - Vertical transistors and methods for forming the same (2026-04-28),

2. 12451462 - Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same (2025-10-21),

3. 12394751 - Method of forming semiconductor structure (2025-08-19),

4. 12137568 - Hybrid bonding contact structure of three-dimensional memory device (2024-11-05),

5. 12089405 - Three-dimensional memory devices with channel structures having plum blossom shape (2024-09-10),

6. 12002788 - Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same (2024-06-04),

7. 11996389 - Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same (2024-05-28),

8. 11877449 - Methods for forming three-dimensional memory devices with channel structures having plum blossom shape (2024-01-16),

9. 11864367 - Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same (2024-01-02),

10. 11758732 - Hybrid bonding contact structure of three-dimensional memory device (2023-09-12),

11. 11749641 - Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same (2023-09-05),

12. 11721668 - Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same (2023-08-08),

13. 11711913 - Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same (2023-07-25),

14. 11694993 - Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same (2023-07-04),

15. 11631688 - Bonded unified semiconductor chips and fabrication and operation methods thereof (2023-04-18),

Title: Inventor Weihua Cheng: Revolutionizing Technology in Wuhan

Introduction: Weihua Cheng is a visionary inventor based in Wuhan, China, known for his groundbreaking contributions to the field of technology.

Latest Patents: Cheng holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Cheng has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Cheng has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange to drive progress in the tech industry.

Conclusion: Weihua Cheng's relentless pursuit of innovation and his passion for creating cutting-edge technologies continue to inspire the next generation of inventors and shape the future of technology.