John M Boyd

Title: John M Boyd: Innovator in Semiconductor Technology

Introduction

John M Boyd is a renowned inventor based in Woodlawn, California, holding a total of 28 patents to his name. His contributions in the field of semiconductor technology have significantly advanced various processes and apparatuses used in manufacturing. Boyd's work is characterized by innovation and a deep understanding of atomic layer deposition and electroless plating techniques.

Latest Patents

Among his notable patents, two recent inventions stand out:

1. **Apparatus and method for atomic layer deposition** – This invention pertains to a proximity head designed for dispensing reactants and purging gas. The proximity head enables the deposition of thin films using Atomic Layer Deposition (ALD) methodology. It features multiple sides, each rotatable to align with the substrate region, and operates within a vacuum chamber that maintains the necessary pressure during application. The design includes gas conduits that dispense reactant and purging gases, along with vacuum conduits to remove excess gases and byproducts from the reaction area.

2. **Method and apparatus for wafer electroless plating** – This patent covers a sophisticated apparatus for electroless plating of semiconductor wafers. The system includes a platen that supports the wafer and a fluid bowl designed to create a liquid-tight seal. With fluid dispense nozzles providing electroplating solutions, the apparatus ensures even coverage over the wafer, promoting optimal plating results.

Career Highlights

John M Boyd's professional journey includes significant tenure at leading companies in the industry. He has worked with Lam Research Corporation, a pivotal player in the semiconductor equipment sector, as well as Northern Telecom Limited, known for its innovation in telecommunications technology. His contributions have made a lasting impact on the advancements in semiconductor manufacturing.

Collaborations

Throughout his career, Boyd has collaborated with notable professionals in his field, including Fritz C Redeker and Yezdi N Dordi. These partnerships have enriched his work experience and contributed to the cutting-edge innovations that Boyd is known for.

Conclusion

John M Boyd stands as a prominent figure in semiconductor technology, with a strong portfolio of patents that reflect his innovative spirit. His recent developments in atomic layer deposition and electroless plating advance industry standards and foster further research and application in the field. Boyd's ongoing contributions will undoubtedly shape the future of semiconductor manufacturing.