The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Apr. 16, 2007
William Thie, Mountain View, CA (US);
John M. Boyd, Woodlawn, CA;
Fritz C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
John Parks, Hercules, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Todd Balisky, Corona, CA (US);
Clint Thomas, Milpitas, CA (US);
Jacob Wylie, Fremont, CA (US);
Alan M. Schoepp, Ben Lomond, CA (US);
William Thie, Mountain View, CA (US);
John M. Boyd, Woodlawn, CA;
Fritz C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
John Parks, Hercules, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Todd Balisky, Corona, CA (US);
Clint Thomas, Milpitas, CA (US);
Jacob Wylie, Fremont, CA (US);
Alan M. Schoepp, Ben Lomond, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.