The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2012

Filed:

Nov. 05, 2009
Applicants:

John Boyd, Woodlawn, CA;

Fritz Redeker, Fremont, CA (US);

Yezdi Dordi, Palo Alto, CA (US);

Hyungsuk Alexander Yoon, San Jose, CA (US);

Shijian LI, San Jose, CA (US);

Inventors:

John Boyd, Woodlawn, CA;

Fritz Redeker, Fremont, CA (US);

Yezdi Dordi, Palo Alto, CA (US);

Hyungsuk Alexander Yoon, San Jose, CA (US);

Shijian Li, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Presented are methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. Another aspect of the present invention includes three-dimensional integrated circuits fabricated according to methods of the present invention.


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