For the Inventor, By the Inventor

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San Luis Obispo, CA, United States of America

Strasbaugh

USPTO Granted Patents = 76

% Expired Patents = 9.2

EPO Patents = 3

Forward Citations = 745

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33 inventors (with patents filed for the assignee):

David G Halley (25 out of 33 patents)

Larry A Spiegel (12 out of 12 patents)

Thomas A Walsh (10 out of 15 patents)

4. William J Kalenian (9 out of 9 patents)

5. Salman Moudrek Kassir (8 out of 10 patents)

6. Michael R Vogtmann (7 out of 15 patents)

7. Stephan H Wolf (6 out of 9 patents)

8. Alan Strasbaugh (6 out of 8 patents)

9. Bill Kalenian (4 out of 4 patents)

10. Thomas E Brake (3 out of 3 patents)

11. John Fuhriman (3 out of 3 patents)

12. Carlton Wells (3 out of 3 patents)

13. Gregory L Barbour (3 out of 3 patents)

14. Ben Smedley (3 out of 3 patents)

15. Stephen H Wolf (3 out of 3 patents)

Core Competencies:

Chemical Mechanical Planarization

Wafer Grinding

Endpoint Detection

Polishing Pad

Wafer Carrier

Optical Sensor

Back Pressure Control

Grinding Spindle

Substrate Processing

Thin Semiconductor Wafers

Slurry Pump

Feature Height Measurement

76 patents: Sort by Forward Citations

1. 9610669 - Methods and systems for use in grind spindle alignment (2017-04-04),

2. 9457446 - Methods and systems for use in grind shape control adaptation (2016-10-04),

3. 9393669 - Systems and methods of processing substrates (2016-07-19),

4. 9193030 - CMP retaining ring with soft retaining ring insert (2015-11-24),

5. 9082713 - Method of grinding wafer stacks to provide uniform residual silicon thickness (2015-07-14),

6. 8968052 - Systems and methods of wafer grinding (2015-03-03),

7. 8915771 - Method and apparatus for cleaning grinding work chuck using a vacuum (2014-12-23),

8. 8740673 - CMP retaining ring with soft retaining ring insert (2014-06-03),

9. 8565919 - Method, apparatus and system for use in processing wafers (2013-10-22),

10. 8520222 - System and method for in situ monitoring of top wafer thickness in a stack of wafers (2013-08-27),

11. 8182312 - CMP system with wireless endpoint detection system (2012-05-22),

12. 8133093 - Grinding apparatus having an extendable wheel mount (2012-03-13),

13. 8052504 - Method, apparatus and system for use in processing wafers (2011-11-08),

14. 7959496 - Flexible membrane assembly for a CMP system and method of using (2011-06-14),

15. 7918712 - Endpoint detection system for wafer polishing (2011-04-05),

Company Overview

Strasbaugh is a leading provider of advanced manufacturing equipment specializing in Chemical Mechanical Planarization (CMP) and wafer grinding technologies. Based in San Luis Obispo, California, the company focuses on developing innovative solutions for the semiconductor industry, enhancing the precision and efficiency of wafer processing. Their expertise encompasses various core technologies, including endpoint detection, polishing pads, optical sensors, and back pressure control, catering to the evolving needs of high-performance semiconductor fabrication.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

76 Patents

#2 in San Luis Obispo, CA

#1,132 in California

#4,846 in US

#9,898 in the World

San Luis Obispo, CA, United States of America

Strasbaugh

Forward Citations = 745

33 inventors:

David G Halley (25 out of 33 patents)

Larry A Spiegel (12 out of 12 patents)

Thomas A Walsh (10 out of 15 patents)

4. William J Kalenian (9 out of 9 patents)

5. Salman Moudrek Kassir (8 out of 10 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Strasbaugh. Retrieved from https://idiyas.com/company/strasbaugh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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