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For the Inventor, By the Inventor

San Luis Obispo, CA, United States of America

Strasbaugh


USPTO Granted Patents = 76

% Expired Patents = 9.2


Forward Citations = 745

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33 inventors (with patents filed for the assignee):

goldMedal David G Halley (25 out of 33 patents)

silverMedal Larry A Spiegel (12 out of 12 patents)

bronzeMedal Thomas A Walsh (10 out of 15 patents)

4.  William J Kalenian (9 out of 9 patents)

5.  Salman Moudrek Kassir (8 out of 10 patents)

6.  Michael R Vogtmann (7 out of 15 patents)

7.  Stephan H Wolf (6 out of 9 patents)

8.  Alan Strasbaugh (6 out of 8 patents)

9.  Bill Kalenian (4 out of 4 patents)

10.  Thomas E Brake (3 out of 3 patents)

11.  John Fuhriman (3 out of 3 patents)

12.  Carlton Wells (3 out of 3 patents)

13.  Gregory L Barbour (3 out of 3 patents)

14.  Ben Smedley (3 out of 3 patents)

15.  Stephen H Wolf (3 out of 3 patents)


Core Competencies:
Chemical Mechanical Planarization
Wafer Grinding
Endpoint Detection
Polishing Pad
Wafer Carrier
Optical Sensor
Back Pressure Control
Grinding Spindle
Substrate Processing
Thin Semiconductor Wafers
Slurry Pump
Feature Height Measurement

76 patents:

1. 9610669 - Methods and systems for use in grind spindle alignment (2017-04-04),
2. 9457446 - Methods and systems for use in grind shape control adaptation (2016-10-04),
3. 9393669 - Systems and methods of processing substrates (2016-07-19),
4. 9193030 - CMP retaining ring with soft retaining ring insert (2015-11-24),
5. 9082713 - Method of grinding wafer stacks to provide uniform residual silicon thickness (2015-07-14),
6. 8968052 - Systems and methods of wafer grinding (2015-03-03),
7. 8915771 - Method and apparatus for cleaning grinding work chuck using a vacuum (2014-12-23),
8. 8740673 - CMP retaining ring with soft retaining ring insert (2014-06-03),
9. 8565919 - Method, apparatus and system for use in processing wafers (2013-10-22),
10. 8520222 - System and method for in situ monitoring of top wafer thickness in a stack of wafers (2013-08-27),
11. 8182312 - CMP system with wireless endpoint detection system (2012-05-22),
12. 8133093 - Grinding apparatus having an extendable wheel mount (2012-03-13),
13. 8052504 - Method, apparatus and system for use in processing wafers (2011-11-08),
14. 7959496 - Flexible membrane assembly for a CMP system and method of using (2011-06-14),
15. 7918712 - Endpoint detection system for wafer polishing (2011-04-05),
Strasbaugh is a leading provider of advanced manufacturing equipment specializing in Chemical Mechanical Planarization (CMP) and wafer grinding technologies. Based in San Luis Obispo, California, the company focuses on developing innovative solutions for the semiconductor industry, enhancing the precision and efficiency of wafer processing. Their expertise encompasses various core technologies, including endpoint detection, polishing pads, optical sensors, and back pressure control, catering to the evolving needs of high-performance semiconductor fabrication.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

76 Patents

#2 in San Luis Obispo, CA

#1,131 in California

#4,837 in US

#9,873 in the World

San Luis Obispo, CA (US)
San Luis Obispo, CA, United States of America

Strasbaugh

Forward Citations = 745

33 inventors:

goldMedal David G Halley (25 out of 33 patents)

silverMedal Larry A Spiegel (12 out of 12 patents)

bronzeMedal Thomas A Walsh (10 out of 15 patents)

4.  William J Kalenian (9 out of 9 patents)

5.  Salman Moudrek Kassir (8 out of 10 patents)

Please report any incorrect information to [email protected]
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