Stephan H Wolf

This inventor holds 9 USPTO granted patents and 1 EPO patent. Top assignees: Strasbaugh, Lam Research Corporation, Other. Active years: 2000-2011.

USPTO Granted Patents = 9

% Patents Active = 77.8

EPO Patents = 1

Average Co-Inventor Count = 1.2

ph-index = 5

Forward Citations = 93(Granted Patents)

Location History:

San Luis Obispo, CA (US) (2000 - 2002)
Los Osos, CA (US) (2002 - 2011)

Company Filing History:

Lam Research Corporation

patents

2 out of 834,411

Other

patents

Years Active: 2000-2011

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7918712 - Endpoint detection system for wafer polishing (2011-04-05),

2. 7195541 - Endpoint detection system for wafer polishing (2007-03-27),

3. 7074110 - Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide (2006-07-11),

4. 7052366 - Endpoint detection system for wafer polishing (2006-05-30),

5. 6780085 - Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process (2004-08-24),

6. 6695681 - Endpoint detection system for wafer polishing (2004-02-24),

7. 6488568 - Optical view port for chemical mechanical planarization endpoint detection (2002-12-03),

8. 6485354 - Polishing pad with built-in optical sensor (2002-11-26),

9. 6146242 - Optical view port for chemical mechanical planarization endpoint (2000-11-14),

Title: The Innovations of Stephan H Wolf

Introduction

Stephan H Wolf is a notable inventor based in Los Osos, California. He holds a total of nine patents, showcasing his significant contributions to the field of technology and innovation. His work primarily focuses on advancements in wafer polishing technology, which is crucial in the semiconductor manufacturing process.

Latest Patents

Among his latest patents is an endpoint detection system for wafer polishing. This innovative wafer polishing pad assembly is designed for use in Chemical Mechanical Planarization (CMP). It includes an optical sensor that senses the reflectivity of the wafer during the polishing process. The system produces a corresponding signal and transmits it from the rotating pad to a stationary portion of the assembly. The signal is transmitted off the pad through non-contact couplings, such as inductive coupling or optical couplings, after being converted into signal formats that enable non-contact transmission.

Career Highlights

Stephan has worked with various companies throughout his career, including Strasbaugh. His experience in the industry has allowed him to develop and refine his innovative ideas, leading to the successful patenting of his technologies.

Collaborations

Stephan has collaborated with notable individuals in his field, including John M Boyd and Randolph E Treur. These collaborations have likely contributed to the development and success of his inventions.

Conclusion

Stephan H Wolf's contributions to wafer polishing technology through his patents demonstrate his innovative spirit and dedication to advancing the semiconductor industry. His work continues to influence the field and inspire future innovations.