William J Kalenian

Title: The Innovative Contributions of William J. Kalenian

Introduction

William J. Kalenian is a notable inventor based in San Luis Obispo, California. He has made significant contributions to the field of wafer processing, holding a total of nine patents. His work focuses on improving methods and systems for grinding and processing substrates, which are essential in various technological applications.

Latest Patents

Kalenian's latest patents include "Methods and systems for use in grind shape control adaptation." This patent describes a method of grinding wafers that involves determining thickness variations and making incremental adjustments to spindle alignment based on predictions of wafer shaper performance. Another significant patent is "Systems and methods of processing substrates," which outlines a process for grinding wafers while ensuring precise thickness measurements through the use of sensors. This innovation allows for real-time adjustments during the grinding process, enhancing the quality and efficiency of wafer production.

Career Highlights

William J. Kalenian is currently employed at Strasbaugh, a company known for its advanced manufacturing solutions. His expertise in wafer processing has positioned him as a key player in the industry, contributing to the development of cutting-edge technologies that improve manufacturing processes.

Collaborations

Kalenian has collaborated with notable colleagues such as Thomas A. Walsh and Larry A. Spiegel. These partnerships have fostered an environment of innovation and creativity, leading to the development of impactful technologies in the field.

Conclusion

William J. Kalenian's contributions to wafer processing through his patents and collaborations highlight his role as an influential inventor in the technology sector. His work continues to shape the future of substrate processing, demonstrating the importance of innovation in advancing manufacturing techniques.