The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Jun. 20, 2007
John Boyd, Woodlawn, CA;
Fritz Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
Hyungsuk Alexander Yoon, San Jose, CA (US);
Shijian LI, San Jose, CA (US);
John Boyd, Woodlawn, CA;
Fritz Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
Hyungsuk Alexander Yoon, San Jose, CA (US);
Shijian Li, San Jose, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
Presented are methods and systems for fabricating three-dimensional integrated circuits having large diameter through-hole vias. One embodiment of the present invention provides a method of processing a wafer having holes for through-hole vias. The method comprises plating a gapfill metal on the wafer. The method also comprises chemically or electrochemically deplating a portion of the overburden metal. The method further comprises using chemical mechanical planarization to planarize the gapfill metal and to remove the remaining overburden metal. Another embodiment of the present invention is an integrated system comprising a process chamber for containing the wafer, a plating component integrated with the process chamber, and a deplating component integrated with the process chamber. The plating component is configured to electrochemically plate a gapfill metal onto the wafer to a least partially fill the holes. The deplating component is configured to chemically or to electrochemically remove a portion of the overburden metal formed by the plating component.