The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Oct. 28, 2011
William Thie, Mountain View, CA (US);
John M. Boyd, Woodlawn, CA;
Fritz C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
John Parks, Hercules, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Todd Balisky, Corona, CA (US);
Clint Thomas, Milpitas, CA (US);
Jacob Wylie, Fremont, CA (US);
Alan M. Schoepp, Ben Lomond, CA (US);
William Thie, Mountain View, CA (US);
John M. Boyd, Woodlawn, CA;
Fritz C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
John Parks, Hercules, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Todd Balisky, Corona, CA (US);
Clint Thomas, Milpitas, CA (US);
Jacob Wylie, Fremont, CA (US);
Alan M. Schoepp, Ben Lomond, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).