The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2010

Filed:

Dec. 15, 2006
Applicants:

Yezdi Dordi, Palo Alto, CA (US);

William Thie, Mountain Viiew, CA (US);

John M. Boyd, Woodlawn, CA;

Fritz C. Redeker, Fremont, CA (US);

Aleksander Owczarz, San Jose, CA (US);

Inventors:

Yezdi Dordi, Palo Alto, CA (US);

William Thie, Mountain Viiew, CA (US);

John M. Boyd, Woodlawn, CA;

Fritz C. Redeker, Fremont, CA (US);

Aleksander Owczarz, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/06 (2006.01); B05C 11/02 (2006.01); B08B 5/00 (2006.01); B08B 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electroless plating chamber is provided. The electroless plating chamber includes a chuck configured to support a substrate and a bowl surrounding a base and a sidewall of the chuck. The base has an annular channel defined along an inner diameter of the base. The chamber includes a drain connected to the annular channel. The drain is capable of removing fluid collected from the chuck. A proximity head capable of cleaning and substantially drying the substrate is included in the chamber. A method for performing an electroless plating operation is also provided.


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