The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Apr. 16, 2007
William Thie, Mountain View, CA (US);
John M. Boyd, Woodlawn, CA;
Fritz C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
John Parks, Hercules, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Todd Balisky, Corona, CA (US);
Clint Thomas, Milpitas, CA (US);
Jacob Wylie, Fremont, CA (US);
Alan M. Schoepp, Ben Lomond, CA (US);
William Thie, Mountain View, CA (US);
John M. Boyd, Woodlawn, CA;
Fritz C. Redeker, Fremont, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
John Parks, Hercules, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Todd Balisky, Corona, CA (US);
Clint Thomas, Milpitas, CA (US);
Jacob Wylie, Fremont, CA (US);
Alan M. Schoepp, Ben Lomond, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.