Jae-Hwa Park

This inventor holds 26 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Devices. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2007-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae-Hwa Park. Retrieved from https://idiyas.com/inventor/jae-hwa-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 (Patent Applications = 4)

% Patents Active = 69.2

Average Co-Inventor Count = 5.4

ph-index = 9

Forward Citations = 399(Granted Patents)

Location History:

Kyeonggi-do, KR (2009)
Gyeonggi-do, KR (2007 - 2016)
Yongin-si, KR (2010 - 2017)

Company Filing History:

26 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2007-2017

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Areas of Expertise:

Semiconductor Devices

Through-Silicon Via

Integrated Circuit

Wafer Bonding

High-k Dielectric

Gate Structure

Decoupling Capacitor

Fabrication Methods

Multilayer Structure

Anisotropic Oxidation

Ohmic Layer

Metal Nitride Layers

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9847276 - Semiconductor devices having through-electrodes and methods for fabricating the same (2017-12-19),

2. 9691684 - Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same (2017-06-27),

3. 9673133 - Semiconductor devices having through-electrodes (2017-06-06),

4. 9490216 - Semiconductor device and semiconductor package (2016-11-08),

5. 9461007 - Wafer-to-wafer bonding structure (2016-10-04),

6. 9379042 - Integrated circuit devices having through silicon via structures and methods of manufacturing the same (2016-06-28),

7. 9337125 - Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure (2016-05-10),

8. 9252141 - Semiconductor integrated circuit, method for fabricating the same, and semiconductor package (2016-02-02),

9. 9214411 - Integrated circuit devices including a through-silicon via structure and methods of fabricating the same (2015-12-15),

10. 9178039 - Semiconductor device (2015-11-03),

11. 9142490 - Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit device (2015-09-22),

12. 8466052 - Method of fabricating semiconductor device having buried wiring (2013-06-18),

13. 7989892 - Gate structure, and semiconductor device having a gate structure (2011-08-02),

14. 7989333 - Methods of forming integrated circuit devices having anisotropically-oxidized nitride layers (2011-08-02),

15. 7879737 - Methods for fabricating improved gate dielectrics (2011-02-01),

Title: Jae-Hwa Park: Pioneering Inventor from Yongin-si, KR

Introduction: Jae-Hwa Park is a distinguished inventor hailing from Yongin-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Park's most recent patents focus on advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we perceive transportation and safety on the roads.

Career Highlights: With over two decades of experience in the tech industry, Park has held key positions in leading research institutions and tech companies, driving forward cutting-edge projects and fostering a culture of innovation.

Collaborations: Throughout his career, Park has collaborated with top engineers, scientists, and designers from around the globe, working on projects that have pushed the boundaries of what is possible in the world of technology.

Conclusion: Jae-Hwa Park's relentless pursuit of innovation and his passion for creating solutions that make a difference have solidified his position as a trailblazer in the field of technology, inspiring the next generation of inventors to dream big and think outside the box.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

4 patents pending: