The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jan. 14, 2015
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Kwang-Jin Moon, Gyeonggi-do, KR;
Tae-Seong Kim, Gyeonggi-do, KR;
Byung-Lyul Park, Seoul, KR;
Jae-Hwa Park, Gyeonggi-do, KR;
Suk-Chul Bang, Gyeonggi-do, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Abstract
Provided are a semiconductor device and a semiconductor package. The semiconductor device includes semiconductor device includes a semiconductor substrate having a first side and a second side. A front-side structure including an internal circuit is disposed on the first side of the semiconductor substrate. A passivation layer is disposed on the second side of the semiconductor substrate. A through-via structure passes through the semiconductor substrate and the passivation layer. A back-side conductive pattern is disposed on the second side of the semiconductor substrate. The back-side conductive pattern is electrically connected to the through-via structure. An alignment recessed area is disposed in the passivation layer. An insulating alignment pattern is disposed in the alignment recessed area.