Enter inventor name

Hui Jae Yoo

This inventor holds 83 USPTO granted patents and 23 published patent applications and 5 EPO patents, primarily in Stacked Memory Devices (CPC class H01L23-5226). Top assignee: Intel Corporation. Active years: 2011-2026.

USPTO Granted Patents = 83 (Patent Applications = 23)

% Patents Active = 91.6

EPO Patents = 5 (Patent Applications = 20)

Average Co-Inventor Count = 6.0

ph-index = 8

Forward Citations = 155(Granted Patents)

Forward Citations (Not Self Cited) = 117(Dec 10, 2025)

Inventors with similar research interests:

🔬 See more inventors

Location History:

Hilsboro, OR (US) (2021)
Hillsboro, OR (US) (2011 - 2024)
Portland, OR (US) (2022 - 2024)

Company Filing History:

82 out of 56,240

Intel Corporation

patents

where one patent can have more than one assignee

Years Active: 2011-2026

Loading Chart...

Areas of Expertise:

Stacked Memory

Thin Film Transistors

Interconnect Structures

Semiconductor Devices

Three Dimensional Circuits

Thermoelectric Devices

Capacitance Reduction

Epitaxial Layers

Backend Memory

Multilayer Vias

Resistive Switching

Air Gaps

83 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12733477 - Damascene interconnect structures with low resistance vias for integrated circuits (2026-09-08),

2. 12713577 - STACKED MEMORY STRUCTURE WITH DUAL-CHANNEL TRANSISTOR (2026-08-18),

3. 12616012 - Stacked random access memory devices with multilayer continuous vias (2026-04-28),

4. 12604479 - Two transistor capacitorless memory cell with stacked thin-film transistors (2026-04-14),

5. 12599032 - Bilayer memory stacking with lines shared between bottom and top memory layers (2026-04-07),

6. 12581857 - Integrated thermoelectric device to mitigate integrated circuit hot spots (2026-03-17),

7. 12526985 - Back-side reveal for power delivery to backend memory with frontend transistors and backend memroy cells (2026-01-13),

8. 12482744 - Subtractively patterned interconnect structures for integrated circuits (2025-11-25),

9. 12406956 - Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers (2025-09-02),

10. 12396155 - Backend memory with air gaps in upper metal layers (2025-08-19),

11. 12376342 - Passivation layers for thin film transistors (2025-07-29),

12. 12310032 - Stacked backend memory with resistive switching devices (2025-05-20),

13. 12300537 - Conformal low temperature hermetic dielectric diffusion barriers (2025-05-13),

14. 12266568 - Interconnect wires including relatively low resistivity cores (2025-04-01),

15. 12255137 - Sideways vias in isolation areas to contact interior layers in stacked devices (2025-03-18),

Title: **Hui Jae Yoo: Innovator in Advanced Semiconductor Technologies**

Introduction

Hui Jae Yoo is an accomplished inventor based in Hillsboro, OR, known for his groundbreaking work in semiconductor technologies. With a notable portfolio of 68 patents, he has made significant contributions to the field, particularly in the development of advanced transistor structures. His innovative spirit continues to drive progress within the industry.

Latest Patents

Among his latest patents is a method for forming an oxide volume within a fin, which involves applying a catalytic oxidant material on the side of a silicon fin and annealing to create a volume of oxide. Additionally, he has developed processes using plasma implant techniques or beam-line implant techniques to introduce oxygen ions, enhancing the functionality of transistors. Another recent invention details a stacked source-drain-gate connection—an advanced device featuring multiple epitaxial regions and gate structures designed to improve semiconductor performance and miniaturization.

Career Highlights

Hui Jae Yoo has established his career at Intel Corporation, one of the leading tech companies in the world. His expertise in semiconductor design and innovation has positioned him as a prominent figure within the research and development teams at Intel. His numerous patents demonstrate his commitment to advancing the capabilities of modern electronics.

Collaborations

Throughout his career, Yoo has collaborated with talented colleagues, including Aaron D. Lilak and Patrick R. Morrow. These partnerships have fostered an environment of creativity and innovation, enabling the team to explore new ideas and refine existing technologies.

Conclusion

Hui Jae Yoo's contributions to semiconductor technology are noteworthy, with a strong focus on innovation and practical applications. His work not only enhances the performance of electronic devices but also paves the way for future advancements in the field. As the technology landscape continues to evolve, inventors like Yoo play a pivotal role in shaping the future of computing and electronics.

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]