The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Aug. 19, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Abhishek A. Sharma, Hillsboro, OR (US);

Clifford Lu Ong, Portland, OR (US);

Van H. Le, Beaverton, OR (US);

Hui Jae Yoo, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); G11C 11/408 (2006.01); G11C 11/412 (2006.01); G11C 11/418 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H10B 41/27 (2023.01); H10B 41/30 (2023.01); H10B 41/35 (2023.01); H10B 43/30 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G11C 11/4087 (2013.01); G11C 11/412 (2013.01); G11C 11/418 (2013.01); H01L 21/76898 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01);
Abstract

Described herein are stacked memory devices that include some peripheral devices for controlling the memory in a separate layer from one or more memory arrays. The layers of the memory device are connected together using vias, which transfer power and data between the layers. In some examples, a portion of the peripheral devices are included in a memory layer, and another portion are included in a peripheral device layer. Multiple layers of memory arrays and/or peripheral devices may be included, e.g., one peripheral device layer may control multiple layers of memory arrays, or different layers of memory arrays may have dedicated peripheral device layers. Different types of memory arrays, such as DRAM or SRAM, may be included.


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