Intel Corporation

Hui Jae Yoo

Patrick R Morrow

Aaron D Lilak

Willy Rachmady

Gilbert W Dewey

Ehren Mannebach

Anh Phan

Abhishek A Sharma

Cheng-Ying Huang

Van H Le

Sean W King

Noriyuki Sato

Kevin Lai Lin

Manish Chandhok

Ramanan Chebiam

Timothy E Glassman

Sreenivas Kosaraju

Jack T Kavalieros

Tristan A Tronic

Kimin Jun

Richard E Schenker

Travis W LaJoie

Sarah Atanasov

Matthew V Metz

James S Clarke

Christopher J Jezewski

Tejaswi K Indukuri

Jeffery D Bielefeld

Rishabh Mehandru

Bernhard Sell

Nafees Kabir

Stephanie A Bojarski

Ram K Krishnamurthy

Kevin O'Brien

Gregory Kengho Chen

Phil Knag

Huseyin Ekin Sumbul

Pei-Hua Wang

Chieh-Jen Ku

Sasikanth Manipatruni

Ravi Pillarisetty

Ian A Young

Sean T Ma

Florian Gstrein

Wilfred Gomes

Eungnak Han

Elliot Tan

Marie Krysak

Miriam Ruth Reshotko

Urusa Alaan

Jasmeet S Chawla

Arnab Sen Gupta

Colin T Carver

Jessica M Torres

Michael Christenson

Robert S Chau

Tanay Gosavi

Kaan Oguz

Elijah V Karpov

James M Blackwell

Christopher J Wiegand

Yan A Borodovsky

Carl H Naylor

David N Shykind

Brennen Karl Mueller

Angeline Smith

Tofizur Rahman

Sudipto Naskar

Benjamin Buford

Chi-Hwa Tsang

Todd R Younkin

Jiun-Ruey Chen

Marko Radosavljevic

Seung Hoon Sung

Charles Henry Wallace

Mauro J Kobrinsky

Robert L Bristol

Nicole K Thomas

Raghavan Kumar

Paul Anton Nyhus

Scott Bruce Clendenning

Fatih Hamzaoglu

Rami Hourani

Satyarth Suri

Gurpreet Singh

Huichu Liu

Sridhar Balakrishnan

Tatyana N Andryushchenko

Gary Allen

Albert Chen

Tobias Brown-Heft

Thoe Michaelos

Christopher M Neumann

Chieh-jen Ku

Rohan Patil

Ahn Phan

Jason Peck

Alekhya Nimmagadda

Jeffrey D Bielefeld

Atm G Sarwar

Integrated circuit (IC) devices implementing bilayer memory stacking with compute logic circuits shared between bottom and top memory layers are disclosed. An example IC device includes a first IC structure that includes one or more memory layers but not necessarily compute logic circuits, the first IC structure being bonded with a second IC structure that includes at least one layer of compute logic circuits and further includes one or more memory layers stacked above the compute logic circuits. The first and second IC structures may be bonded so that the compute logic circuits of the second IC structure may be communicatively coupled to memory layers of both the first and second IC structures.

Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers

An example IC device includes a frontend layer and a backend layer with a metallization stack. The metallization stack includes a backend memory layer with a plurality of memory cells with backend transistors, and a layer with a plurality of conductive interconnects (e.g., a plurality of conductive lines) and air gaps between adjacent ones of the plurality of interconnects. Providing air gaps in upper metal layers of metallization stacks of IC devices may advantageously reduce parasitic effects in the IC devices because such effects are typically proportional to the dielectric constant of a surrounding medium. In turn, reduction in the parasitic effects may lead to improvements in performance of, or requirements placed on, the backend memory.

Backend memory with air gaps in upper metal layers

A thin film transistor (TFT) structure includes a gate electrode, a gate dielectric layer on the gate electrode, a channel layer including a semiconductor material with a first polarity on the gate dielectric layer. The TFT structure also includes a multi-layer material stack on the channel layer, opposite the gate dielectric layer, an interlayer dielectric (ILD) material over the multi-layer material stack and beyond a sidewall of the channel layer. The TFT structure further includes source and drain contacts through the interlayer dielectric material, and in contact with the channel layer, where the multi-layer material stack includes a barrier layer including oxygen and a metal in contact with the channel layer, where the barrier layer has a second polarity. A sealant layer is in contact with the barrier layer, where the sealant layer and the ILD have a different composition.

Passivation layers for thin film transistors

IC devices with stacked backend memory with resistive switching devices are disclosed. An example IC device includes a support structure, a frontend layer with a plurality of frontend devices, and a backend layer with a plurality of resistive switching devices, the resistive switching devices being, e.g., part of memory cells of stacked backend memory. For example, the backend layer may implement stacked arrays of 1T-1RSD memory cells, with resistive switching devices coupled to some S/D regions of access transistors of the memory cells. Such memory cells may be used to implement stacked eMRAM or eRRAM, with access transistors being TFTs. Stacked TFT-based eMRAM or eRRAM as described herein may help increase density of MRAM or RRAM cells, hide the peripheral circuits that control the memory operation below the memory arrays, and address the scaling challenge of some conventional memory technologies.

Stacked backend memory with resistive switching devices

Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.

Conformal low temperature hermetic dielectric diffusion barriers

A dielectric layer and a method of forming thereof. An opening defined in a dielectric layer and a wire deposited within the opening, wherein the wire includes a core material surrounded by a jacket material, wherein the jacket material exhibits a first resistivity ρ1 and the core material exhibits a second resistivity ρ2 and ρ2 is less than ρ1.

Interconnect wires including relatively low resistivity cores

Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. In an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. In an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.

Sideways vias in isolation areas to contact interior layers in stacked devices

Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes to form volumes of oxide within a fin, such as a Si fin. In embodiments, this may be accomplished by applying a catalytic oxidant material on a side of a fin and then annealing to form a volume of oxide. In embodiments, this may be accomplished by using a plasma implant technique or a beam-line implant technique to introduce oxygen ions into an area of the fin and then annealing to form a volume of oxide. Processes described here may be used manufacture a transistor, a stacked transistor, or a three-dimensional (3-D) monolithic stacked transistor.

Forming an oxide volume within a fin

A device is disclosed. The device includes a first epitaxial region, a second epitaxial region, a first gate region between the first epitaxial region and a second epitaxial region, a first dielectric structure underneath the first epitaxial region, a second dielectric structure underneath the second epitaxial region, a third epitaxial region underneath the first epitaxial region, a fourth epitaxial region underneath the second epitaxial region, and a second gate region between the third epitaxial region and a fourth epitaxial region and below the first gate region. The device also includes, a conductor via extending from the first epitaxial region, through the first dielectric structure and the third epitaxial region, the conductor via narrower at an end of the conductor via that contacts the first epitaxial region than at an opposite end.

Stacked source-drain-gate connection and process for forming such

An integrated circuit (IC) structure in a memory device is described. In an example, the IC structure includes a memory cell including a bitline (BL) extending along a first direction and a channel extending along a second direction above and diagonal to the BL. In the example, a wordline (WL) extends in a third direction perpendicular to the first direction of the BL and intersects with the channel to control a current in the channel along a gated channel length. In some examples, the channel is electrically coupled on a first side to a storage capacitor via a storage node contact (SNC) and on a second side to the BL via a bit line contact (BLC) located on an underside or backside of the channel.

Thin film transistors having a backside channel contact for high density memory

Disclosed herein are transistors, memory cells, and arrangements thereof. For example, in some embodiments, an integrated circuit (IC) structure may include a plurality of transistors, wherein the transistors are distributed in a hexagonally packed arrangement. In another example, in some embodiments, an IC structure may include a memory cell including an axially symmetric transistor coupled to an axially symmetric capacitor, wherein the axis of the transistor is aligned with the axis of the capacitor.

Transistors, memory cells, and arrangements thereof

Backside contact structures include etch selective materials to facilitate backside contact formation. An integrated circuit structure includes a frontside contact region, a device region below the frontside contact region, and a backside contact region below the device region. The device region includes a transistor. The backside contact region includes a first dielectric material under a source or drain region of the transistor, a second dielectric material laterally adjacent to the first dielectric material and under a gate structure of the transistor. A non-conductive spacer is between the first and second dielectric materials. The first and second dielectric materials are selectively etchable with respect to one another and the spacer. The backside contact region may include an interconnect feature that, for instance, passes through the first dielectric material and contacts a bottom side of the source/drain region, and/or passes through the second dielectric material and contacts the gate structure.

Backside contacts for semiconductor devices

Thin film transistors fabricated using a spacer as a fin are described. In an example, a method of forming a fin transistor structure includes patterning a plurality of backbone pillars on a semiconductor substrate. The method may then include conformally depositing a spacer layer over the plurality of backbone pillars and the semiconductor substrate. A spacer etch of the spacer layer is then performed to leave a sidewall of the spacer layer on a backbone pillar to form a fin of the fin transistor structure. Other embodiments may be described and claimed.

Fabrication of thin film fin transistor structure

IC interconnect structures including subtractively patterned features. Feature ends may be defined through multiple patterning of multiple cap materials for reduced misregistration. Subtractively patterned features may be lines integrated with damascene vias or with subtractively patterned vias, or may be vias integrated with damascene lines or with subtractively patterned lines. Subtractively patterned vias may be deposited as part of a planar metal layer and defined currently with interconnect lines. Subtractively patterned features may be integrated with air gap isolation structures. Subtractively patterned features may be include a barrier material on the bottom, top, or sidewall. A bottom barrier of a subtractively patterned features may be deposited with an area selective technique to be absent from an underlying interconnect feature. A barrier of a subtractively patterned feature may comprise graphene or a chalcogenide of a metal in the feature or in a seed layer.

Subtractively patterned interconnect structures for integrated circuits

Growing community of inventors

Hillsboro, OR, United States of America

Hui Jae Yoo