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Hsing-Chih Lin

USPTO Granted Patents = 65 (Patent Applications = 7)

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 102(Granted Patents)

Forward Citations (Not Self Cited) = 86(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

65 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2016-2025

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Areas of Expertise:

Metal-Insulator-Metal Device

Hybrid Bonding Technology

Integrated Circuits

Backside Contact Techniques

Through Silicon Vias

Semiconductor Image Sensors

Thermal Dissipation

Stacked Semiconductor Devices

Inductor Structures

CMOS Image Sensors

Shield Structures

Thermal Displacement

65 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12322694 - Metal-insulator-metal device with improved performance (2025-06-03),

2. 12315843 - Hybrid bonding technology for stacking integrated circuits (2025-05-27),

3. 12300669 - Backside contact for thermal displacement in a multi-wafer stacked integrated circuit (2025-05-13),

4. 12283564 - Semiconductor structure and manufacturing method thereof (2025-04-21),

5. 12278250 - Semiconductor device including image sensor and method of forming the same (2025-04-14),

6. 12230554 - Shield structure for backside through substrate vias (TSVs) (2025-02-18),

7. 12218165 - Semiconductor image sensor and method of manufacturing the same (2025-02-04),

8. 12218106 - Backside contact to improve thermal dissipation away from semiconductor devices (2025-02-04),

9. 12205868 - Oversized via as through-substrate-via (TSV) stop layer (2025-01-21),

10. 12057446 - Stacked semiconductor device and method (2024-08-06),

11. 12034037 - Backside capacitor techniques (2024-07-09),

12. 12033919 - Backside or frontside through substrate via (TSV) landing on metal (2024-07-09),

13. 11996429 - CMOS image sensor structure with microstructures on backside surface of semiconductor layer (2024-05-28),

14. 11955428 - Semiconductor structure and manufacturing method thereof (2024-04-09),

15. 11942368 - Through silicon vias and methods of fabricating thereof (2024-03-26),

Title: The Innovative Journey of Inventor Hsing-Chih Lin

Introduction: Hsing-Chih Lin, a distinguished inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Lin's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Lin has established himself as a pioneer in the renewable energy sector, holding multiple patents that have revolutionized the industry.

Collaborations: Throughout his career, Lin has collaborated with leading research institutions and universities to further his research and bring his innovative ideas to life. His partnerships have led to the successful implementation of cutting-edge technologies in the market.

Conclusion: Hsing-Chih Lin's dedication to innovation and his relentless pursuit of excellence have solidified his position as a visionary inventor in the field of renewable energy, inspiring future generations to push the boundaries of what is possible in technology.

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