Hsing-Chih Lin

This inventor holds 67 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Technology (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016-2026.

USPTO Granted Patents = 67 (Patent Applications = 8)

% Patents Active = 91.0

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 106(Granted Patents)

Forward Citations (Not Self Cited) = 86(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

67 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2016-2026

Loading Chart...

Areas of Expertise:

Metal-Insulator-Metal Device

Hybrid Bonding Technology

Thermal Dissipation

Image Sensor

Through-Substrate-Vias

Stacked Integrated Circuits

CMOS Structure

Oversized Via

Backside Contact

Semiconductor Structure

Integrated Circuit

67 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12635501 - Integrated chip including through-substrate via (TSV) and landing structure (2026-05-19),

2. 12525528 - Metal-insulator-metal device with improved performance (2026-01-13),

3. 12322694 - Metal-insulator-metal device with improved performance (2025-06-03),

4. 12315843 - Hybrid bonding technology for stacking integrated circuits (2025-05-27),

5. 12300669 - Backside contact for thermal displacement in a multi-wafer stacked integrated circuit (2025-05-13),

6. 12283564 - Semiconductor structure and manufacturing method thereof (2025-04-21),

7. 12278250 - Semiconductor device including image sensor and method of forming the same (2025-04-14),

8. 12230554 - Shield structure for backside through substrate vias (TSVs) (2025-02-18),

9. 12218165 - Semiconductor image sensor and method of manufacturing the same (2025-02-04),

10. 12218106 - Backside contact to improve thermal dissipation away from semiconductor devices (2025-02-04),

11. 12205868 - Oversized via as through-substrate-via (TSV) stop layer (2025-01-21),

12. 12057446 - Stacked semiconductor device and method (2024-08-06),

13. 12034037 - Backside capacitor techniques (2024-07-09),

14. 12033919 - Backside or frontside through substrate via (TSV) landing on metal (2024-07-09),

15. 11996429 - CMOS image sensor structure with microstructures on backside surface of semiconductor layer (2024-05-28),

Title: The Innovative Journey of Inventor Hsing-Chih Lin

Introduction: Hsing-Chih Lin, a distinguished inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Lin's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Lin has established himself as a pioneer in the renewable energy sector, holding multiple patents that have revolutionized the industry.

Collaborations: Throughout his career, Lin has collaborated with leading research institutions and universities to further his research and bring his innovative ideas to life. His partnerships have led to the successful implementation of cutting-edge technologies in the market.

Conclusion: Hsing-Chih Lin's dedication to innovation and his relentless pursuit of excellence have solidified his position as a visionary inventor in the field of renewable energy, inspiring future generations to push the boundaries of what is possible in technology.