logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsin-Chieh Yao

USPTO Granted Patents = 51 

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 108(Granted Patents)

Forward Citations (Not Self Cited) = 103(Dec 10, 2025)


Location History:

  • Douliu, TW (2013 - 2016)
  • Yunlin County, TW (2016)
  • Hsinchu, TW (2014 - 2024)

Company Filing History:

goldMedal51 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

Loading Chart...
Areas of Expertise:
Semiconductor Device Structure
Interconnection Structure
Self-Aligned Interconnect
Dielectric on Wire Structure
Double Patterning Approach
Integrated Chip Formation
Barrier Structure
Chemical-Mechanical Planarization
Extreme Ultraviolet Mask
Tapered Sidewall Conductive Lines
Selective Deposition
Dark Field Inspection
51 patents (USPTO):Explore Patents
1. 12476142 - Semiconductor device structure and methods of forming the same (2025-11-18),
2. 12424488 - Dual etch-stop layer structure (2025-09-23),
3. 12406924 - Interconnection structure and methods of forming the same (2025-09-02),
4. 12362231 - Self-assembled dielectric on metal rie lines to increase reliability (2025-07-15),
5. 12322723 - Self-aligned interconnect structure (2025-06-03),
6. 12315817 - Dielectric on wire structure to increase processing window for overlying via (2025-05-27),
7. 12300611 - Interconnect conductive structure comprising two conductive materials (2025-05-13),
8. 12300541 - Structure and formation method of semiconductor device with carbon-containing conductive structure (2025-05-13),
9. 12266565 - Integrated chip with an etch-stop layer forming a cavity (2025-04-01),
10. 12243775 - Double patterning approach by direct metal etch (2025-03-04),
11. 12125795 - Integrated chip with inter-wire cavities (2024-10-22),
12. 12094823 - Interconnection structure and methods of forming the same (2024-09-17),
13. 11972975 - Semiconductor device structure having air gap and method for forming the same (2024-04-30),
14. 11942364 - Selective deposition of a protective layer to reduce interconnect structure critical dimensions (2024-03-26),
15. 11923293 - Barrier structure on interconnect wire to increase processing window for overlying via (2024-03-05),

Title: Inventor Hsin-Chieh Yao

Introduction: Hsin-Chieh Yao is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hsin-Chieh Yao holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Hsin-Chieh Yao has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Hsin-Chieh Yao has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous breakthrough inventions.

Conclusion: Hsin-Chieh Yao's passion for innovation, coupled with his technical acumen and collaborative spirit, has solidified his reputation as a visionary inventor at the forefront of technological advancement.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…