Hsin-Chieh Yao

This inventor holds 57 USPTO granted patents and 28 published patent applications, primarily in Semiconductor Structures. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

USPTO Granted Patents = 57 (Patent Applications = 28)

% Patents Active = 82.5

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 121(Granted Patents)

Forward Citations (Not Self Cited) = 103(Dec 10, 2025)

Location History:

Douliu, TW (2013 - 2016)
Yunlin County, TW (2016)
Hsinchu, TW (2014 - 2024)

Company Filing History:

57 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2026

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Areas of Expertise:

Semiconductor Structure

Interconnect Structure

Dielectric Reliability

Dual Etch-Stop Layer

Integrated Chip

Self-Aligned Interconnect

Carbon-Containing Conductive

Patterning Approach

Wire Structure

Protective Layer

Processing Window

Sidewall Spacer

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685130 - Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability (2026-07-14),

2. 12666947 - Semiconductor device including self-aligned via and method of manufacturing the same (2026-06-23),

3. 12635511 - Semiconductor device having air gap and method for manufacturing the same (2026-05-19),

4. 12635496 - Semiconductor device including interconnects with lower contact resistance (2026-05-19),

5. 12628630 - Interconnect structure with reinforcing spacer and method for manufacturing the same (2026-05-12),

6. 12532500 - Semiconductor structure (2026-01-20),

7. 12476142 - Semiconductor device structure and methods of forming the same (2025-11-18),

8. 12424488 - Dual etch-stop layer structure (2025-09-23),

9. 12406924 - Interconnection structure and methods of forming the same (2025-09-02),

10. 12362231 - Self-assembled dielectric on metal rie lines to increase reliability (2025-07-15),

11. 12322723 - Self-aligned interconnect structure (2025-06-03),

12. 12315817 - Dielectric on wire structure to increase processing window for overlying via (2025-05-27),

13. 12300611 - Interconnect conductive structure comprising two conductive materials (2025-05-13),

14. 12300541 - Structure and formation method of semiconductor device with carbon-containing conductive structure (2025-05-13),

15. 12266565 - Integrated chip with an etch-stop layer forming a cavity (2025-04-01),

Title: Inventor Hsin-Chieh Yao

Introduction: Hsin-Chieh Yao is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hsin-Chieh Yao holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Hsin-Chieh Yao has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Hsin-Chieh Yao has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous breakthrough inventions.

Conclusion: Hsin-Chieh Yao's passion for innovation, coupled with his technical acumen and collaborative spirit, has solidified his reputation as a visionary inventor at the forefront of technological advancement.