Fu-Shou Tsai

This inventor holds 20 USPTO granted patents. Top assignees: United Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fu-Shou Tsai. Retrieved from https://idiyas.com/inventor/fu-shou-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 100.0

Average Co-Inventor Count = 6.5

ph-index = 3

Forward Citations = 17(Granted Patents)

Location History:

Keeling, TW (2018)
Keelung, TW (2016 - 2022)
Kaohsiung, TW (2024)

Company Filing History:

20 out of 7,269

United Microelectronics Corp.

patents

4 out of 354

Fujian Jinhua Integrated Circuit Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2016-2026

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12543548 - Semiconductor structure and method for forming the same (2026-02-03),

2. 11923205 - Method for manufacturing semiconductor device (2024-03-05),

3. 11257711 - Fabricating method of transistors without dishing occurred during CMP process (2022-02-22),

4. 11211471 - Method of manufacturing a semiconductor device (2021-12-28),

5. 10943910 - Method for forming semiconductor integrated circuit structure (2021-03-09),

6. 10923481 - Semiconductor integrated circuit structure (2021-02-16),

7. 10734276 - Planarization method (2020-08-04),

8. 10722998 - Wafer polishing pad and using method thereof (2020-07-28),

9. 10192826 - Conductive layout structure including high resistive layer (2019-01-29),

10. 10128251 - Semiconductor integrated circuit structure and method for forming the same (2018-11-13),

11. 10103034 - Method of planarizing substrate surface (2018-10-16),

12. 10049887 - Method of planarizing substrate surface (2018-08-14),

13. 9972498 - Method of fabricating a gate cap layer (2018-05-15),

14. 9905430 - Method for forming semiconductor structure (2018-02-27),

15. 9887158 - Conductive structure having an entrenched high resistive layer (2018-02-06),

Title: The Innovative Journey of Fu-Shou Tsai

Introduction: Fu-Shou Tsai, a distinguished inventor hailing from Keelung, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Fu-Shou Tsai holds several patents in the areas of electronics, telecommunications, and renewable energy. His most recent patents focus on sustainable energy solutions and advanced communication systems.

Career Highlights: With a career spanning over two decades, Fu-Shou Tsai has worked for leading tech companies, where he spearheaded research and development projects that led to the creation of cutting-edge technologies. His innovative mindset and problem-solving skills have been instrumental in his success as an inventor.

Collaborations: Throughout his career, Fu-Shou Tsai has collaborated with top researchers, engineers, and scientists from around the world. These collaborations have resulted in the development of revolutionary products and technologies that have had a lasting impact on the industry.

Conclusion: Fu-Shou Tsai's passion for innovation and his relentless pursuit of excellence have established him as a visionary inventor in the field of technology. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]