The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Dec. 26, 2017
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Kun-Ju Li, Tainan, TW;
Kuo-Chin Hung, Changhua County, TW;
Min-Chuan Tsai, New Taipei, TW;
Wei-Chuan Tsai, Changhua County, TW;
Yi-Han Liao, Taichung, TW;
Chun-Tsen Lu, Tainan, TW;
Fu-Shou Tsai, Keelung, TW;
Li-Chieh Hsu, Taichung, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 29/41 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/485 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76843 (2013.01); H01L 21/76846 (2013.01); H01L 21/76883 (2013.01); H01L 23/485 (2013.01); H01L 23/5228 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 29/41758 (2013.01); H01L 29/66628 (2013.01); H01L 29/7833 (2013.01);
Abstract
A layout structure including a conductive structure is provided. The layout structure includes a dielectric layer formed on a substrate and a conductive structure formed in the dielectric layer. And the conductive structure further includes a barrier layer, a metal layer formed within the barrier layer, and a high resistive layer sandwiched in between the barrier layer and the metal layer.