CA

François Pelletier

This inventor holds 21 USPTO granted patents and 6 published patent applications, plus 1 CIPO patent and 1 EPO patent, primarily in Integrated Photonics. Top assignees: Ciena Corporation, Teraxion Inc.. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: François Pelletier. Retrieved from https://idiyas.com/inventor/francois-pelletier

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 100.0


 

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 67(Granted Patents)


Location History:

  • St-Augustin-de-Desmaures, CA (2005)
  • Saint-Augustin-de-Desmaures, CA (2010 - 2014)
  • Québec, CA (2016)
  • St-Augustin, CA (2017)
  • St. Augustin, CA (2020)
  • Quebec, CA (2017 - 2022)
  • Saint-Michel, CA (2022)

Company Filing History:


Years Active: 2005-2026

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Areas of Expertise:
Fabricated Wafers
Adhesive Material Shaping
Trench Depth Management
Thermal Control
Hybrid Chip Assembly
Photonic Integration
Stray Light Absorption
Optical Filtering
Flip-Chip Components
Optical Chip Assembly
Wavelength-Tuning
Dispersion Compensator
21 patents (USPTO):Explore Patents

Title: The Innovative Contributions of François Pelletier

Introduction

François Pelletier is a notable inventor based in Canada, recognized for his significant contributions to the field of photonics and chip technology. With a total of nine patents to his name, Pelletier has made strides in enhancing the functionality and efficiency of integrated systems.

Latest Patents

Among his latest patents, one focuses on managing trench depth in integrated systems. This invention involves the formation of photonic structures within layers over a substrate surface, where multiple trenches are created. These trenches are characterized by varying surface topologies and roughness at different depths within the substrate. Another notable patent is for enhanced thermal control of a hybrid chip assembly. This method involves using structural adhesive to anchor a carrier chip to a host chip, ensuring optical alignment and mechanical stability.

Career Highlights

Throughout his career, François Pelletier has worked with prominent companies such as Ciena Corporation and Teraxion Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

Pelletier has collaborated with talented individuals in his field, including Charles Baudot and Christine Latrasse. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

François Pelletier's work exemplifies the spirit of innovation in the technology sector. His patents and collaborations reflect a commitment to advancing integrated systems and chip technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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