The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Sep. 25, 2023
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Charles Baudot, Quebec, CA;

Raphael Beaupré-Laflamme, Quebec, CA;

François Pelletier, Quebec, CA;

Simon Savard, Quebec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4228 (2013.01); G02B 6/4245 (2013.01); G02B 6/4212 (2013.01); G02B 6/4231 (2013.01); G02B 6/4291 (2013.01); G02B 6/4295 (2013.01);
Abstract

A first photonic integrated circuit (PIC) comprises a first optical element optically coupled to a first coupling region at an edge of the first PIC. A second PIC is formed in part from a multilayer structure comprising a bottom layer, a top layer comprising a first material with a first index of refraction, and a middle layer comprising a second material with a second lower index of refraction and having a first thickness between the bottom and top layers. The second PIC comprises a plurality of vertical alignment pedestals comprising a portion of the middle layer having the first thickness and attached to at least a portion of the bottom layer, a plurality of thinned regions, and a second optical element optically coupled to a second coupling region at an edge of the second PIC. Two or more of the vertical alignment pedestals are adhered to the first PIC.


Find Patent Forward Citations

Quick Actions:

Baudot, Charles. (2026). Managing co-packaging of photonic integrated circuits (U.S. Patent No. 12782654). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12782654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…