Method and apparatus for managing heat distribution in a semiconductor device

Abstract

Aspects of the subject disclosure may include, for example, a process that provides a semiconductor substrate and forms repeating, conductive patterns configured for coupling to active circuitry. Each pattern comprises a group of thermally conductive layers, wherein the group of thermally layers is thermally coupled to a thermal source generated by the active circuitry. Thermally conductive vias interconnect the group of thermally conductive layers, wherein a combination of the vias and the group of thermally conductive layers is configured to transfer heat from the thermal source with a desired directionality. The first repeating patterns are thermally coupled to each other to combine the desired directionality of each of the patterns, wherein the combination results in a distributed directionality of the heat from the thermal source thereby reducing a localized concentration of the heat. Other embodiments are disclosed.