The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Jul. 07, 2015
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Francois Pelletier, Quebec, CA;

Christine Latrasse, Quebec, CA;

Marie-Josée Picard, Quebec, CA;

Michel Poulin, Quebec, CA;

Yves Painchaud, Quebec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/38 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4292 (2013.01); G02B 6/421 (2013.01); G02B 6/3839 (2013.01); G02B 6/4204 (2013.01); G02B 6/428 (2013.01);
Abstract

A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.


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