The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

May. 30, 2023
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Raphael Beaupré-Laflamme, Quebec, CA;

Nicolas Boyer, Magog, CA;

François Pelletier, Quebec, CA;

Simon Savard, Quebec, CA;

Veronique Jomphe Allain, Québec, CA;

Luc Bélanger, Quebec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/13 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12 (2013.01); G02B 6/13 (2013.01); G02B 6/4212 (2013.01); G02B 6/4215 (2013.01); G02B 6/4279 (2013.01);
Abstract

An article of manufacture comprises: at least a portion of a wafer comprising a substrate and one or more layers fabricated on the substrate; one or more integrated photonic structures in the portion of the wafer, where at least a first integrated photonic structure of the one or more integrated photonic structures is associated with an electromagnetic wave propagation region that extends beyond a first surface of a first layer of the one or more layers; an array of liquid guiding structures arranged in a two-dimensional pattern on a portion of the first surface of the first layer; and an adhesive material making contact with the first surface of the first layer and with at least a majority of the liquid guiding structures in the array of liquid guiding structures.


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