The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Jan. 12, 2022
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Benoît Filion, Lévis, CA;

Charles Baudot, Quebec, CA;

François Pelletier, Quebec, CA;

Christine Latrasse, Quebec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); G02B 6/136 (2006.01); H01L 21/308 (2006.01); H01L 21/762 (2006.01); B81C 1/00 (2006.01); G02B 6/12 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76229 (2013.01); G02B 6/136 (2013.01); H01L 21/3085 (2013.01); H01L 21/76283 (2013.01); B81C 1/00412 (2013.01); G02B 2006/12176 (2013.01); H01L 21/30604 (2013.01); H01L 21/3065 (2013.01);
Abstract

One or more photonic structures are formed within one or more layers over a surface of a substrate, and multiple trenches are formed through the one or more layers housing devices coupled to one or more of the photonic structures. The trenches may include: a first trench that has a bottom surface within the substrate that has a first surface topology characterized by a first surface roughness at a first depth within the substrate relative to the surface of the substrate, and a second trench that has a bottom surface within the substrate that has a second surface topology characterized by a second surface roughness at a second depth within the substrate relative to the surface of the substrate. The first surface roughness may be greater than the second surface roughness, and the second depth may be greater than the first depth.


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