This inventor holds 143 USPTO granted patents and 40 published patent applications, primarily in Image Sensor Technology (CPC class H01L27-14636). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008-2026.
Inventors with similar research interests:
Location History:
- Zhubei, TW (2009)
- Hsin-Chu, TW (2016)
- Hsin-Chu County, TW (2015 - 2022)
- Chu-Bei, TW (2008 - 2024)
Company Filing History:
Years Active: 2008-2026
Areas of Expertise:
Title: Feng-Chi Hung: Pioneering Innovator with 119 Patents
Introduction:
Feng-Chi Hung, a resident of Chu-Bei, Taiwan, is a prominent inventor and engineer known for his remarkable contributions to the field of semiconductor technology. With an impressive portfolio of 119 patents, Hung has continuously pushed the boundaries of innovation in integrated chip structures and image sensor devices. This article explores some of his latest patents, highlights his career achievements, and sheds light on his collaborations with esteemed colleagues.
Latest Patents:
Hung's recent patents showcase his expertise in developing cutting-edge solutions for the semiconductor industry. One notable patent is the "Hybrid Bond Pad Structure," an integrated chip structure with multiple groundbreaking features. This innovation involves a unique arrangement of interconnects and bonding structures within two inter-level dielectric structures, providing enhanced versatility and performance to integrated chip designs.
Another remarkable invention from Hung is the "Image Sensor with Overlap of Backside Trench Isolation Structure and Vertical Transfer Gate." This patent focuses on enhancing the capabilities of image sensor devices by integrating a photodetector with a transfer transistor. The design incorporates a backside trench isolation structure that strategically overlaps with the vertical portion of the transfer transistor, allowing for improved performance and efficiency in image sensing applications.
Career Highlights:
Hung's career highlights are a testament to his expertise and innovative mindset. He has been an integral part of Taiwan Semiconductor Manufacturing Company Limited (TSMC), one of the world's leading semiconductor foundries. At TSMC, Hung has played a pivotal role in driving technological advancements, contributing to the company's reputation as an industry frontrunner.
Collaborations:
Hung has had the privilege of working alongside esteemed colleagues throughout his career. Notably, he has collaborated with Dun-Nian Yaung and Jen-Cheng Liu on various projects. These collaborations underline the importance of teamwork and synergy in the field of inventions and patents, furthering the collective knowledge and expertise surrounding semiconductor technology.
Conclusion:
Feng-Chi Hung's prolific career and contribution of 119 patents have solidified his position as a pioneering innovator in the semiconductor industry. His ingenuity and dedication to pushing technological boundaries have undoubtedly influenced the advancement of integrated chip structures and image sensor devices. As an esteemed member of the Taiwan Semiconductor Manufacturing Company Limited, Hung continues to inspire and shape the future of semiconductor technology.