The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jan. 04, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wei Long Chen, New Taipei City, TW;
Wen-I Hsu, Tainan City, TW;
Feng-Chi Hung, Chu-Bei City, TW;
Jen-Cheng Liu, Hsin-Chu City, TW;
Dun-Nian Yaung, Taipei City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Various embodiments of the present disclosure are directed towards an image sensor. The image sensor comprise a substrate having a first region and a second region. A first gate overlies the first region. A second gate overlies the second region. A deep trench isolation (DTI) structure is in the substrate and laterally between the first region and the second region. A first floating diffusion node is in the first region. A second floating diffusion node is in the second region. An interlayer dielectric (ILD) structure is over the substrate. A dielectric structure is between the ILD structure and the substrate. The dielectric structure is laterally between the first and second floating diffusion nodes. The dielectric structure is laterally spaced from the first and second gates. The dielectric structure overlies the DTI structure. A width of the dielectric structure is greater than a width of the DTI structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile