Chun-Chieh Chuang

This inventor holds 85 USPTO granted patents and 4 published patent applications, primarily in Image Sensor Technology (CPC class H01L27-1464). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Winbond Electronics Corporation, Other. Active years: 2008-2026.

USPTO Granted Patents = 85 (Patent Applications = 4)

% Patents Active = 76.5

Average Co-Inventor Count = 5.8

ph-index = 9

Forward Citations = 568(Granted Patents)

Forward Citations (Not Self Cited) = 467(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Chi-Lung, TW (2011)
Hsin-Chu, TW (2014)
Tainan, TW (2008 - 2023)

Company Filing History:

82 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 2,106

Winbond Electronics Corporation

patents

2 out of 834,411

Other

patents

Years Active: 2008-2026

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Areas of Expertise:

Image Sensor

3DIC Interconnect

Hybrid Bonding

Epitaxial Isolation

Backside Illuminated

Semiconductor Devices

Dual Isolation

Manufacturing Methods

Low Resistance Contact

Ridge Structure

Copper Alloy

85 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12734368 - Interconnect structure and method of forming same (2026-09-15),

2. 12720898 - Semiconductor capacitor for stacked pixel (2026-08-25),

3. 12476224 - 3DIC interconnect apparatus and method (2025-11-18),

4. 12300670 - Hybrid bond pad structure (2025-05-13),

5. 11804473 - Hybrid bond pad structure (2023-10-31),

6. 11798916 - 3DIC interconnect apparatus and method (2023-10-24),

7. 11596800 - Interconnect structure and method of forming same (2023-03-07),

8. 11152414 - Image sensor including dual isolation and method of making the same (2021-10-19),

9. 11024602 - Hybrid bond pad structure (2021-06-01),

10. 11011567 - Structure and method for 3D image sensor (2021-05-18),

11. 10886320 - Mechanisms for forming image-sensor device with epitaxial isolation feature (2021-01-05),

12. 10879297 - Image sensor device and method of forming same (2020-12-29),

13. 10861899 - Interconnect structure for stacked device and method (2020-12-08),

14. 10682523 - Interconnect structure and method of forming same (2020-06-16),

15. 10535706 - Interconnect structure for stacked device and method (2020-01-14),

Title: The Innovative Journey of Chun-Chieh Chuang

Introduction:

Chun-Chieh Chuang, a distinguished inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chun-Chieh Chuang's latest patents include cutting-edge advancements in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Chun-Chieh Chuang has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing solutions that push the boundaries of what is possible. His work has not only earned him recognition within the industry but has also positively impacted the lives of many around the world.

Collaborations:

Throughout his career, Chun-Chieh Chuang has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion:

In conclusion, Chun-Chieh Chuang's relentless pursuit of innovation and his passion for creating technologies that make a difference have solidified his position as a trailblazer in the world of inventors. His work continues to inspire future generations to think outside the box and strive for excellence in all their endeavors.