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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Daniel N Sobieski

USPTO Granted Patents = 17 

 

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 28(Granted Patents)


Company Filing History:

goldMedal17 out of 54,890 
 
Intel Corporation
 patents

Years Active: 2016-2024

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17 patents (USPTO):Explore Patents
1. 12009318 - Control of warpage using ABF GC cavity for embedded die package (2024-06-11),
2. 11322457 - Control of warpage using ABF GC cavity for embedded die package (2022-05-03),
3. 10692847 - Inorganic interposer for multi-chip packaging (2020-06-23),
4. 10658307 - Control of warpage using ABF GC cavity for embedded die package (2020-05-19),
5. 10494700 - Method of fabricating a microelectronic substrate (2019-12-03),
6. 10375832 - Method of forming an interference shield on a substrate (2019-08-06),
7. 10103037 - Flexible microelectronic systems and methods of fabricating the same (2018-10-16),
8. 10070537 - Formation of dielectric with smooth surface (2018-09-04),
9. 9941219 - Control of warpage using ABF GC cavity for embedded die package (2018-04-10),
10. 9941054 - Integration of embedded thin film capacitors in package substrates (2018-04-10),
11. 9899311 - Hybrid pitch package with ultra high density interconnect capability (2018-02-20),
12. 9758845 - Microelectronic substrates having copper alloy conductive route structures (2017-09-12),
13. 9633938 - Hybrid pitch package with ultra high density interconnect capability (2017-04-25),
14. 9520350 - Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer (2016-12-13),
15. 9505610 - Device, system and method for providing MEMS structures of a semiconductor package (2016-11-29),

Title: Unveiling the Innovations of Inventor Daniel N Sobieski

Introduction:

Daniel N Sobieski, a prolific inventor based in Phoenix, AZ, has made significant contributions to the field of semiconductor devices with a remarkable portfolio of 16 patents. His innovative spirit and expertise shine through in each of his groundbreaking inventions.

Latest Patents:

1. Control of warpage using ABF GC cavity for embedded die package: In this patent, Sobieski introduces semiconductor device packages with a die-side reinforcement layer and a unique cavity design. The package encompasses a build-up structure with alternating layers of conductive and insulating material, showcasing his ingenuity in addressing warpage issues.

2. Inorganic interposer for multi-chip packaging: Sobieski's patent highlights methods and devices for multichip packages featuring an inorganic interposer. This technology includes high density interconnect circuitry, connecting multiple chips efficiently. The use of inorganic materials demonstrates his commitment to enhancing packaging solutions.

Career Highlights:

Daniel N Sobieski is a valuable asset at Intel Corporation, where his innovative mindset and technical prowess have led to groundbreaking advancements in semiconductor technologies. His exceptional problem-solving skills and creativity have positioned him as a leader in the industry.

Collaborations:

Within Intel Corporation, Sobieski collaborates closely with esteemed colleagues such as Sri Ranga Sai Boyapati and Digvijay Ashokkumar Raorane. Together, they form a dynamic team driving innovation and pushing the boundaries of semiconductor packaging technologies.

Conclusion:

Inventor Daniel N Sobieski's relentless pursuit of excellence and passion for innovation have defined his remarkable career. His patents reflect his dedication to solving complex challenges in semiconductor packaging, making him a trailblazer in the industry. Sobieski's continued contributions are poised to shape the future of semiconductor technologies, solidifying his legacy as a visionary inventor.

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