logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10103037 B1

PDFFull Text
Date of Patent:
Oct. 16, 2018

Filed:

May. 09, 2014

Flexible microelectronic systems and methods of fabricating the same

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Aleksandar Aleksov, Chandler, AZ (US);

Dilan Seneviratne, Chandler, AZ (US);

Charavana K. Gurumurthy, Gilbert, AZ (US);

Ching-Ping J. Shen, Gilbert, AZ (US);

Daniel N. Sobieski, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Green, Howard & Mughal, LLP

Primary Examiner:

Ajay K Arora

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/564 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/96 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 24/45 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/06 (2013.01); H01L 2924/062 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/181 (2013.01); H01L 2924/186 (2013.01); H01L 2924/1811 (2013.01);
Abstract

Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.

Find Patent Forward Citations

Loading…