The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Mar. 09, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Deepak Arora, Chandler, AZ (US);
Daniel N. Sobieski, Phoenix, AZ (US);
Dilan Seneviratne, Chandler, AZ (US);
Ebrahim Andideh, Tempe, AZ (US);
James C. Meyer, Tualatin, OR (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H05K 3/46 (2006.01); C23C 14/22 (2006.01); H05K 3/42 (2006.01); H05K 3/10 (2006.01); H01L 21/48 (2006.01); B32B 43/00 (2006.01); H01L 21/44 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); C23C 14/228 (2013.01); H05K 3/0035 (2013.01); H05K 3/0055 (2013.01); H05K 3/42 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 21/44 (2013.01); H01L 21/48 (2013.01); H01L 21/565 (2013.01); H05K 3/0014 (2013.01); H05K 3/0044 (2013.01); H05K 3/107 (2013.01); H05K 3/281 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1152 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1978 (2015.01);
Abstract
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.