The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Aug. 31, 2015
Intel Corporation, Santa Clara, CA (US);
Daniel Sobieski, Phoenix, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Merve Celikkol, Chandler, AZ (US);
Kyu Oh Lee, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Zhiguo Qian, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Discussed generally herein are methods and devices for multichip packages that include an inorganic interposer. A device can include a substrate including low density interconnect circuitry therein, an inorganic interposer on the substrate, the inorganic interposer including high density interconnect circuitry electrically connected to the low density interconnect circuitry, the inorganic interposer including inorganic materials, and two or more chips electrically connected to the inorganic interposer, the two or more chips electrically connected to each other through the high density interconnect circuitry.